Etching solution for microscopic analysis of copper foil and preparation method and etching method thereof
A technology of microscopic analysis and preparation method, which is applied in the field of microscopic analysis of copper foil materials, and can solve problems such as complex sample processing
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Embodiment 1
[0025] According to the etching solution for copper foil microscopic analysis described in the embodiment of the present invention, its preparation method comprises the following steps:
[0026] S1 Prepare saturated cupric ammonium chloride ((NH 4 ) 2 CuCl 4 )·H 2 O solution, add (NH 4 ) 2 CuCl 4 Crystalline solid (purity 98%), the temperature of the aqueous solution in the beaker is controlled at 35°C, and (NH 4 ) 2 CuCl 4 Solid until the solid no longer dissolves to obtain a saturated cupric ammonium chloride solution;
[0027] S2 preparation of saturated FeCl 3 Solution, add 5mL dilute hydrochloric acid in 100mL water, continue to add FeCl while stirring 3 solid, the temperature of the aqueous solution in the beaker is controlled at 25°C until the solid is no longer dissolved, and a saturated ferric chloride solution is obtained;
[0028] S3 Prepare the etching solution, use a graduated cylinder to measure 20mL saturated cupric ammonium chloride solution, 10 mL s...
Embodiment 2
[0034] The following uses the etching method described in Example 1 to etch any copper foil on the market, and the etching effect will be further described in detail.
[0035] The effect of metallographic microscope shooting of copper foil before and after etching by etching solution is as follows: figure 1 As shown, the copper surface before etching is rough and has no obvious graininess, and the outline of copper particles cannot be seen directly, which is not conducive to microscopic crystal analysis. After etching, the crystal grain outline on the copper surface is obvious, and the copper particles can be clearly distinguished, which is beneficial to microscopic crystal analysis.
[0036] The SEM and EBSD shooting effects of copper foil before and after etching by etching solution are as follows: figure 2 As shown, the copper surface is flat before etching, and the grains cannot be distinguished, and the microscopic grain size and lattice orientation cannot be analyzed...
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