Lead bonding quality prediction control method based on machine learning
A quality prediction and wire bonding technology, applied in the field of wire bonding quality prediction control based on machine learning, can solve the inevitable quality and efficiency problems, slow detection feedback, bonding quality decline and other problems, to achieve quality prediction and The effect of process optimization, improving product yield and reducing inspection cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0030] In order to better understand the above technical solution, the above-described technical scheme will be described in detail below in conjunction with the drawings and specific embodiments.
[0031] A machine-based lead bond mass prediction control method is provided by the present invention, see figure 1 , Including the following steps:
[0032] Step S1: Several key process parameters for selecting the lead bonded as the key influencing factors of lead bonding, based on the key influencing factors, build quality prediction neural network models;
[0033] Step S2: Collect the real-time process parameters corresponding to the key influencing factors as described when the lead keying machine is acquired;
[0034] Step S3: According to the real-time process parameters, the quality predicted neural network model is used to perform lead bonding mass prediction, and obtain the quality prediction result; the process parameters of the lead bonding machine are adjusted according to ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap