Chip mounting structure and preparation method thereof

Abstract

The invention provides a chip mounting structure and a preparation method thereof. The preparation method comprises the steps of: mounting a chip on a substrate; manufacturing an isolation layer around the chip; reserving a gas inlet and a gas outlet in the isolation layer; coating the gas inlet with an underfill material; applying negative pressure to the gas outlet; making an underfill adhesive material flow into the bottom of a chip assembly based on air pressure to form an underfill adhesive. The gas inlet and the gas outlet are prepared in the isolation layer, the gas inlet is coated with the underfill material, the negative pressure is applied to the gas outlet, and the underfill adhesive is pressed into the bottom of the chip under the action of air pressure by increasing the negative pressure, so that the filling difficulty of the underfill adhesive can be reduced. The process is simple; the problem that effective underfill is difficult to form at the bottom of the chip can be solved, the problem of bubble filling can be solved, and the process efficiency and the product yield are improved. According to the method, the problem that a certain chip only needs to be filled in a specific area can be effectively solved, and the bottom of the chip can be flexibly filled.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a mounted chip structure and a preparation method thereof, and is especially suitable for a large-size mounted chip structure and its preparation. Background technique [0002] The bottom mounting technology of the chip is the main way for the chip to be connected to the terminal. In order to prevent the large stress difference between the chip and the substrate from causing the solder balls to break, it is often necessary to fill the bottom glue between the chip and the substrate. [0003] However, as the size of the chip becomes larger and larger, it is very difficult for the underfill to completely occupy the space at the bottom of the chip. If there are a large number of bubbles embedded in the underfill of the chip, in the subsequent thermal process and reliability experiments, the bubbles will It may break the chip and cause damage to the module. In addi...

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Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a mounting chip structure and its preparation method, which are used to solve the problem of the difficulty in forming an effective underfill at the bottom of the chip in the prior art and the difficulty in achieving only one chip for a certain chip. Issues such as needing padding in certain positions

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