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Speed ​​planning method for chip packaging control and chip packaging control device

A technology of speed planning and chip packaging, applied in the direction of program control, digital control, electrical program control, etc., can solve problems such as difficulty in functioning and fixed displacement, and achieve the effects of improving accuracy, preventing overshoot, and suppressing residual vibration

Active Publication Date: 2021-10-01
东莞普莱信智能技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, because the chip packaging control system has the characteristics of short stroke, high acceleration, high speed and high precision positioning, and the displacement is relatively fixed, the above technical solutions are difficult to play a role

Method used

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  • Speed ​​planning method for chip packaging control and chip packaging control device
  • Speed ​​planning method for chip packaging control and chip packaging control device
  • Speed ​​planning method for chip packaging control and chip packaging control device

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Experimental program
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Effect test

Embodiment 1

[0066] A speed planning method for chip packaging control, the point trajectory speed curve of the packaging control is an asymmetric S-curve, and the movement of the point is driven by a shaft motor, such as figure 1 As shown, the asymmetrical S-curve is divided into seven operating stages according to the acceleration and deceleration characteristics: acceleration and acceleration segment 0-T 1 , uniform acceleration section T 1 -T 2 , deceleration acceleration section T 2 -T 3 , constant velocity section T 3 -T 4 , Acceleration and deceleration section T 4 -T 5 , Uniform deceleration section T 5 -T 6 and deceleration section T 6 -T 7 , the planning method includes:

[0067] S1: Set the interpolation cycle, the number of interpolation cycles at the start end, the number of interpolation cycles at the stop end, the allowable excitation energy intensity value, the upper limit of the adjustment change rate, the speed modification resolution, and the acceleration modi...

Embodiment 2

[0123] The present invention further provides a chip packaging control device for realizing the above speed planning method, such as figure 2 As shown, it includes a host computer 1, a drive-control integrated controller 2, an X-axis linear motor 51, a Y-axis linear motor 52, a Z-axis linear motor 53, and an IO actuator 54; the host computer 1 and the drive-control integrated control The device 2 is connected by communication, and the drive-control integrated controller 2 is connected by communication with the X-axis linear motor 51, the Y-axis linear motor 52, the Z-axis linear motor 53, and the IO actuator 54;

[0124] The drive-control integrated controller 2 includes a motion control unit 3 and a drive control unit 4, the motion control unit 3 communicates with the upper computer 1 and the drive control unit 4, and the drive control unit 4 communicates with the X-axis The linear motor 51, the Y-axis linear motor 52, the Z-axis linear motor 53, and the IO actuator 54 are c...

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Abstract

The invention provides a speed planning method for chip packaging control, through the maximum acceleration A, maximum deceleration D, jerk J a , deceleration J d Optimally adjust the speed curve of the point trajectory so that the total movement time T b Decrease, modify the resolution by speed, modify the resolution by acceleration to constrain A, D, J a 、J d The adjustment range, and by adjusting the upper limit of the rate of change to constrain the rate of change of the parameter adjustment results, while limiting the value of the permissible excitation energy intensity, can improve the efficiency of chip packaging, prevent overshooting of speed planning, and improve the accuracy of chip packaging control; also provides A chip packaging control device is used to realize the speed planning method of chip packaging control.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a speed planning method for chip packaging control and a chip packaging control device. Background technique [0002] With the rapid development of the integrated circuit industry and the continuous improvement of chip manufacturing technology, miniaturized, multi-pin, and fine-pitch chips have put forward higher requirements for the response ability, positioning accuracy, and positioning time of the high-acceleration motion system of packaging equipment. High requirements often require the motion platform to move to a given target position quickly, smoothly and accurately in a very short time. However, during the high-acceleration short-stroke point-to-point movement with frequent and rapid start-stops, external disturbances, mechanical resonance, and nonlinear factors of the control system itself all affect the servo performance of the system to varying degrees, direc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/416
CPCG05B19/416G05B2219/36521Y02P70/10
Inventor 田兴银张勇毛军
Owner 东莞普莱信智能技术有限公司