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Metal circuit structure based on FPC and processing method thereof

A metal circuit and processing method technology, applied in the direction of metal pattern materials, printed circuit, printed circuit manufacturing, etc., can solve the problems of peeling, difficult to control the thickness of copper, tin and pure tin, and the height of the line, so as to avoid the effect of peeling

Pending Publication Date: 2021-07-23
APLUS SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are usually many small circuits on the COF. On the one hand, these circuits need to be firmly attached to the film to avoid falling off. Since tin and copper will form a copper-tin alloy, in the prior art, in order to maintain the thickness of pure tin on the surface of the circuit after baking, it is necessary to thicken the tin layer during tinning. On the other hand, it is not easy to control the thickness of pure tin after the diffusion of copper and tin, which also increases the defective rate and production cost

Method used

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  • Metal circuit structure based on FPC and processing method thereof
  • Metal circuit structure based on FPC and processing method thereof
  • Metal circuit structure based on FPC and processing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The metal circuit structure manufactured by the above-mentioned processing method, after processing, the first metal layer 2 is copper with a thickness of 8 microns, the middle layer 3 is nickel with a thickness of 30 nanometers, and the second metal layer 4 is tin with a thickness of 100 nanometers. After standing, the thickness of each layer of metal remains basically unchanged.

Embodiment 2

[0041]The metal circuit structure manufactured by the above-mentioned processing method, after processing, the first metal layer 2 is copper with a thickness of 8 microns, the middle layer 3 is nickel with a thickness of 30 nanometers, and the second metal layer 4 is tin with a thickness of 200 nanometers. After standing, the thickness of each layer of metal remains basically unchanged.

Embodiment 3

[0043] The metal circuit structure manufactured by the above-mentioned processing method, after processing, the first metal layer 2 is copper with a thickness of 8 microns, the middle layer 3 is nickel with a thickness of 30 nanometers, and the second metal layer 4 is tin with a thickness of 160 nanometers. After standing, the thickness of each layer of metal remains basically unchanged.

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Abstract

The invention discloses an FPC-based metal circuit structure and a processing method thereof. The FPC-based metal circuit structure comprises a base material film; a first metal layer which is attached to the surface of the base material film; a second metal layer which is positioned above the first metal layer; and a middle layer which is arranged between the first metal layer and the second metal layer, the upper surface and the lower surface of the middle layer are connected with the first metal layer and the second metal layer respectively, and the middle layer is made of materials which are not prone to reacting with the second metal layer. The middle layer is arranged between the first metal layer and the second metal layer, diffusion between the first metal layer and the second metal layer is blocked, it is guaranteed that the second metal layer maintains a certain thickness, the height of a circuit is not too high, and the circuit is prevented from being stripped from the base material film.

Description

technical field [0001] The invention belongs to the technical field of metal circuit structures, and in particular relates to an FPC-based metal circuit structure and a processing method thereof. Background technique [0002] FPC refers to flexible circuit board, which is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. Referred to as soft board or FPC, it has the characteristics of high wiring density, light weight, and thin thickness. [0003] COF refers to the chip-on-chip film, which is a technology of fixing the driver IC on the flexible circuit board. One of the higher precision requirements in FPC, COF has higher requirements on the thickness of pure tin. There are usually many small circuits on the COF. On the one hand, these circuits need to be firmly attached to the film to avoid falling off. Since tin and copper will form a copper-tin alloy, in the prior art, in order to maintain the thickn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K1/11H05K3/10H05K3/18
CPCH05K1/09H05K1/111H05K1/118H05K3/10H05K3/188
Inventor 陈正能蔡水河王允男王乔晖
Owner APLUS SEMICON TECH CO LTD