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Process film for FPC manufacturing process, preparation method and application thereof

A technology of release film and pressure-sensitive adhesive layer, which is applied in the direction of pressure-sensitive film/sheet, film/sheet-shaped adhesive, adhesive type, etc., which can solve the problem of lamination failure, module damage, FPC sticking To solve the problems of low bonding efficiency, achieve high adhesion and adhesion, ensure effective bonding, good adhesion and pollution-free effects

Pending Publication Date: 2021-07-27
上海精珅新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the small size of the FPC as a whole, it is difficult to fix it when attaching it to the module, and it is easy to cause the failure of the attachment, resulting in damage to the module, which makes the bonding efficiency of the FPC on the module lower.

Method used

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  • Process film for FPC manufacturing process, preparation method and application thereof
  • Process film for FPC manufacturing process, preparation method and application thereof
  • Process film for FPC manufacturing process, preparation method and application thereof

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preparation example Construction

[0040] Correspondingly, the present application also provides a method for preparing the process film 100 for the FPC process, which is used to prepare the process film 100 for the FPC process described above. Specifically, see figure 2, the preparation method of the process film 100 for FPC process provided in the present application includes: step S100, after corona treatment is performed on one side of the substrate 110, it is left to stand for a first preset time. Here, it should be pointed out that the substrate 110 used can be made of PET, PO, PVC or PP, etc., which can be adjusted according to usage requirements. Also, the thickness of the base material 110 may be set to 50 μm. The parameters of the corona treatment process for the substrate 110 can be set according to different corona devices and different requirements for surface energy. In a possible implementation manner, the power of the corona device may specifically be set to: 1.9KW.

[0041] Then, through st...

Embodiment 1

[0046] It should be noted that, in this embodiment, the preparation process of the process film 100 for the FPC process is as follows:

[0047] Firstly, a PET film is used as the substrate 110, and one side of the substrate 110 is subjected to corona treatment so that one side of the substrate 110 is a corona surface. Wherein, in this embodiment, the substrate 110 used has a thickness of 50 μm, and the process parameters for corona treatment on the substrate 110 are: the power of the corona device is set to 1.9KW.

[0048] After corona treatment is performed on the base material 110 , it is left to stand for a period of time (the standing time is: 1 day to 2 days, ie, 24 hours to 48 hours). At the same time, the components used to prepare the pressure-sensitive adhesive layer 120 are accurately weighed in sequence, added to the solvent and stirred evenly to obtain a pressure-sensitive adhesive.

[0049] Specifically, in this embodiment, 60 g of the resin as the main body of t...

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Abstract

The invention relates to a process film for an FPC manufacturing process. The process film is used for attaching an FPC to a module in a FPC manufacturing process and comprises a base material, a pressure-sensitive adhesive layer and a release film layer, wherein one surface of the base material is a corona surface, the corona surface of the base material is coated with the pressure-sensitive adhesive layer, the release film layer is compounded on the pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer comprises a matrix resin, and further comprises at least one of a UV monomer, a photoinitiator and a cross-linking agent. According to the invention, the process film is attached to a surface coating of an FPC in a FPC manufacturing process so as to fixedly bear the FPC in a module, and due to the high viscosity characteristic, the process film has high attaching performance and adhesive force on a surface coating material of the FPC, so that fixing of the FPC in the module is effectively improved; in the whole FPC manufacturing process, the high-temperature environment in the manufacturing process can be borne; and the process film for the FPC manufacturing process has good adhesion and no pollution to a coating material on the surface of the FPC, so that the process film can be applied to the whole manufacturing process of the FPC without influencing the manufacturing process of the FPC.

Description

technical field [0001] The present application relates to the technical field of semiconductor preparation, in particular to a process film for FPC process and its preparation method and application. Background technique [0002] FPC (Flexible Printed Circuit, flexible circuit board) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film, with high wiring density and low weight. Light, thin, and good bendability. Among them, the FPC needs to be bonded to the module during the manufacturing process. In related technologies, the FPC is usually directly bonded to the module. However, due to the small size of the FPC as a whole, it is difficult to fix it when attaching it to the module, and it is easy to cause the failure of the attachment, resulting in damage to the module, so that the efficiency of attaching the FPC to the module is low. Contents of the invention [0003] In view of this, the present application proposes a pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/25C09J7/38C09J133/02C09J133/04C09J175/14
CPCC09J7/255C09J7/38C09J7/385C09J133/02C09J133/04C09J175/14C09J2467/006C09J2433/00C09J2475/00C08L33/04C08L75/14
Inventor 孙攀牛建超李奇
Owner 上海精珅新材料有限公司
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