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Semiconductor sheet surface defect and thickness detection device and method

A thickness detection and semiconductor technology, which is applied in the field of surface defects of semiconductor sheets and thickness detection devices, can solve the problems of the influence of the measurement accuracy of the thickness detection device of semiconductor sheets, the reduction of the reception rate of reflected light, the reduction of the arrival rate of emitted light, and the like. The effect of reducing losses, increasing density, and reducing performance impact

Active Publication Date: 2021-07-30
徐州博创建设发展集团有限公司
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Problems solved by technology

[0006] The object of the present invention is to provide a surface defect and thickness detection device and method for semiconductor sheets to solve the problem that the above-mentioned dust and impurities not only reduce the arrival rate of emitted light, but also reduce the reception rate of reflected light, resulting in surface defects of semiconductor sheets. and the problem that the measurement accuracy of the thickness detection device is affected

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  • Semiconductor sheet surface defect and thickness detection device and method
  • Semiconductor sheet surface defect and thickness detection device and method
  • Semiconductor sheet surface defect and thickness detection device and method

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Embodiment Construction

[0040] The present invention will be described in detail below in conjunction with various embodiments shown in the drawings. However, these embodiments do not limit the present invention, and structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0041] The invention discloses a surface defect and thickness detection device of a semiconductor sheet. Figure 1-Figure 3 As shown, it includes a detection base 1 , a dust collection mechanism 2 , an air wall mechanism 3 , a wind collection mechanism 4 and a synergistic mechanism 5 .

[0042] ginseng Figure 2-Figure 4 As shown, the detection base 1 is provided with a dust collection mechanism 2, the dust collection mechanism 2 includes a support base 201, and the support base 201 can form a uniform air cavity with the detection base 1 through the support of the cavity rod 203, and at the same time, the second A dus...

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Abstract

The invention discloses a semiconductor sheet surface defect and thickness detection device, which comprises a detection base, a dust collection mechanism, an air wall mechanism, an air collection mechanism and a synergistic mechanism. The dust collection mechanism is arranged in the detection base; the dust collection mechanism comprises a support bottom support; a first dust collection box is arranged in the support bottom support; and the air wall mechanism is arranged in the support bottom support. The air wall mechanism comprises a first air blower; and the detection base and the support bottom support are both connected with guide clamps. Through arrangement of corresponding mechanisms on the semiconductor sheet surface defect and thickness detection device, dust and impurities in a detection range are effectively reduced, the arrival rate of emitted light is improved, and the receiving rate of reflected light is also improved, so that the influence of dust and impurities on the semiconductor sheet surface defect and thickness detection device is reduced, the influence on the performance of the semiconductor sheet during subsequent preparation and application is synchronously reduced, and the loss of manufacturers is reduced.

Description

technical field [0001] The invention belongs to the technical field of detection devices, and in particular relates to a detection device and method for surface defects and thickness of semiconductor sheets. Background technique [0002] Semiconductor sheets have been widely used in daily life. Due to the high requirements on the surface of semiconductor sheets when they are used, once the surface of semiconductor sheets is incomplete, it will not only affect the subsequent preparation, but also affect its performance during application. Therefore, it is necessary to detect the surface defects and thickness of the semiconductor sheet before using it. [0003] There are many methods for detecting semiconductor sheets, such as capacitance method, microwave method and optical reflection method. The most commonly used method is the optical reflection method. Signal collection and calculation analysis to obtain sample thickness and surface defect information. [0004] There are...

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Application Information

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IPC IPC(8): G01D21/02B01D46/30
CPCB01D46/30G01D21/02
Inventor 闫长春
Owner 徐州博创建设发展集团有限公司
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