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Enhanced conductive paste and electronic device

A conductive paste, enhanced technology, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of substrate shedding, limited application, poor substrate adhesion, etc., and achieve the goal of improving adhesion Effect

Active Publication Date: 2021-07-30
BEIJING DREAM INK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The inventors found that the conductive paste in the prior art has poor adhesion to the substrate during application, and is easy to fall off from the substrate, so its application is limited

Method used

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  • Enhanced conductive paste and electronic device
  • Enhanced conductive paste and electronic device
  • Enhanced conductive paste and electronic device

Examples

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preparation example Construction

[0051] Optionally, the method for preparing the enhanced conductive paste in the embodiment of the present invention may include the following steps:

[0052] Step S1, preparing reinforcing filler;

[0053] In one example, the reinforcing structure in the reinforcing filler is carbon fiber, and the metal layer is a silver layer. The preparation process of the reinforcing filler includes: grinding carbon fiber filaments or chopped strands by ball milling and then sieving, degumming, removing Oil, roughening, sensitization, activation, chemical silver plating, surface coating anti-oxidation layer and other links.

[0054] In another example, the reinforcing structure in the reinforcing filler is silicon carbide whisker, the metal layer is a silver layer, and the preparation process of the reinforcing filler includes: roughening, sensitization, activation, electroless silver plating, surface coating anti-oxidation layer, etc. link.

[0055] Of course, if the reinforcing structu...

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Abstract

The invention provides enhanced conductive paste and an electronic device, and relates to the technical field of new materials. The enhanced conductive paste provided by the invention is prepared from the following materials in percentage by weight: 4 to 20 percent of resin, 4 to 10 percent of curing agent, 50 to 80 percent of conductive filler, 5 to 35 percent of enhanced filler, 5 to 25 percent of solvent and 0.05 to 4 percent of additive; the reinforcing filler comprises whiskers with the tensile strength of 1 GPa or above, a linear or fibrous reinforcing structure and a metal layer wrapping the reinforcing structure, and the conductivity of the metal layer is better than that of the reinforcing structure; and the length of the reinforcing filler is 0.1 [mu]m to 25 [mu]m. According to the technical scheme, the adhesive force of the conductive structure and the base material in the electronic device can be improved.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular to a reinforced conductive paste and an electronic device. Background technique [0002] In recent years, with the rapid development of electronic information technology, the market has increasingly stringent requirements on the specificity and functionality of conductive pastes. In order to meet the above requirements, the conductive paste has gradually developed from a single material such as metal and carbon to a composite conductive paste. Composite conductive pastes are mostly made of solid conductive media and carrier substances, such as conductive particles such as silver powder, copper powder, carbon powder, graphene, etc., and epoxy resin, acrylic resin, polyurethane resin, vinyl chloride-vinyl acetate copolymer resin , Silicone resin and other compounds. [0003] The inventors found that the conductive paste in the prior art has poor adhesion to the substrate durin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B1/24
CPCH01B1/22H01B1/24
Inventor 王汉杰任中伟
Owner BEIJING DREAM INK TECH CO LTD
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