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Power semiconductor device

A technology of power semiconductors and devices, applied in semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as easy short circuit of pins, easy de-soldering of pins, poor heat dissipation effect of power semiconductor devices, etc. , to achieve the effect of enhancing air flow efficiency, improving welding quality, and improving surface heat dissipation effect

Inactive Publication Date: 2021-07-30
刘家宝
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a power semiconductor device to solve the problems in the prior art that the pins of the power semiconductor device are easy to desolder, short circuit between the pins, and the heat dissipation effect of the power semiconductor device is poor.

Method used

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  • Power semiconductor device
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Embodiment Construction

[0024] see figure 1 , a power semiconductor device, comprising a power semiconductor device main body 1, the side end surface of the power semiconductor device main body 1 is provided with a wiring groove 12, the number of the wiring grooves 12 is two, and two groups of wiring grooves 12 are located on two sides of the power semiconductor device main body 1 At the top of the side, the side end surface of the wiring groove 12 is welded with a pin inner core 2, and the outer end of the pin inner core 2 is provided with a protective ceramic square tube 3, and the protective ceramic square tube 3 and the wiring groove 12 are connected by a high temperature resistant glue. A heat insulating pad 13 is connected, and a heat dissipation groove 11 is opened on the upper surface of the main body 1 of the power semiconductor device, and a heat dissipation film 111 is coated inside the heat dissipation groove 11 .

[0025] see figure 2 , the pin inner core 2 is an L-shaped silver cylind...

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Abstract

The invention discloses a power semiconductor device which comprises a power semiconductor device body, wiring grooves are formed in the side end face of the power semiconductor device body, the two wiring grooves are located in the tops of the two sides of the power semiconductor device body, pin inner cores are arranged on the side end faces of the wiring grooves, and the outer ends of the pin inner cores are sleeved with protective ceramic square tubes. A heat insulation pad is arranged between the protective ceramic square tube and the wiring groove, a heat dissipation groove is formed in the upper end face of the power semiconductor device body, and a heat dissipation film is arranged in the heat dissipation groove. The outer end faces of the pin inner cores are sleeved with the protective ceramic square tubes, short circuit between the pin inner cores is avoided, meanwhile, the welding quality of the pin inner cores is improved, the power semiconductor device body is supported through the protective ceramic square tubes, a gap is reserved between the power semiconductor device and a circuit board, a graphene film is laid at the upper end of the power semiconductor device main body, so that the heat dissipation effect of the power semiconductor device main body is improved.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, in particular to a power semiconductor device. Background technique [0002] Power Electronic Devices, also known as power semiconductor devices, are mainly used for high-power electronic devices in power conversion and control circuits of power equipment (usually referring to currents of tens to thousands of amps and voltages of hundreds of volts or more. , Power devices are used in almost all electronic manufacturing industries, including notebooks, PCs, servers, displays and various peripherals in the computer field; mobile phones, telephones and other various terminals and local end devices in the field of network communications; Traditional black and white home appliances and various digital products; industrial PCs in industrial control, various instruments and meters and various control equipment, etc., in addition to ensuring the normal operation of these equipment, power devic...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/367H01L23/373H01L23/467H01L23/473H01L23/49
CPCH01L23/3121H01L23/3672H01L23/373H01L23/467H01L23/473H01L23/49
Inventor 刘家宝
Owner 刘家宝
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