Solder resist film removal method and solder resist film removal solution

A film-removing and solder-resisting technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve problems such as poor quality, inability to meet the requirements of film-removing heavy work, and low efficiency, so as to improve quality, shorten backwashing time, The effect of process simplification
CN113194627BActive Publication Date: 2021-09-03TEAN ELECTRONICS DA YA BAY CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
TEAN ELECTRONICS DA YA BAY CO LTD
Publication Date
2021-09-03

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Abstract

The invention relates to a method for removing solder resist film and a solution for removing solder resist film, which is carried out according to the following steps: step 1, prepare defective boards; step 2, put defective boards into racks; Check the temperature of the solder resist film removal solution; step 4, put the bad board and the rack into the potion tank, and soak for T1 time continuously; step 5, put the bad board and the rack into the first washing pool equipped with an ultrasonic device, and wash it with water. Soak for T2 time; step 6, put the bad board and the insert into the second washing pool, wash and soak for T3 time; step 7, transfer the bad board to the first drying process, and dry it with strong hot air; step 8, the bad board The board enters the second drying process and is dried with hot air; step 9, the defective board enters the cold air cooling process for cooling treatment; step 10, the board is collected. The invention shortens the backwashing time by 40 minutes, improves the efficiency, reduces the backwashing temperature, saves energy, improves the quality, and cleans the inside of the 0.2mm via hole.
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Description

technical field

[0001] The invention relates to the technical field of power circuits, in particular to a solder resist film removal method and a solder resist film removal solution. Background technique

[0002] With the development trend of miniaturization and high density of electronic products, the aperture of the via hole is getting smaller and smaller, and the requirements for rework (rework) of solder mask stripping are getting higher and higher. When PTH (PTH is the abbreviation of Plated Through Hole, plated through hole is the meaning of metallized hole) via hole <0.2mm, it is easy to cause abnormalities such as ink plugging and poor backwashing.

[0003] In the existing process flow: bad board β†’ insert frame β†’ soaking in liquid medicine tank (time 50-60min, temperature 80-90℃) β†’ washing soaking 1 (time 10min) β†’ washing soaking 2 (time 10min) β†’ high-pressure water gun washing β†’ developing Punching (relative moving speed 1m / min) β†’ plate collection (Note: The pot...

Claims

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