Solder resist film removal method and solder resist film removal solution

A film-removing and solder-resisting technology, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve problems such as poor quality, inability to meet the requirements of film-removing heavy work, and low efficiency, so as to improve quality, shorten backwashing time, The effect of process simplification

Active Publication Date: 2021-09-03
TEAN ELECTRONICS DA YA BAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to solve the problems of low efficiency, poor quality and inability to meet the requirements of the existing PCB film removal process in the existing caustic soda film removal process.

Method used

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  • Solder resist film removal method and solder resist film removal solution
  • Solder resist film removal method and solder resist film removal solution

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Embodiment Construction

[0041] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0042] A method for removing a solder resist film, carried out according to the following steps:

[0043] Step 1, prepare the bad board to be unfilmed;

[0044] Step 2, install the defective board into the socket;

[0045] Step 3, equip the solder mask stripping potion in the potion tank without an ultrasonic device, and set the temperature of the solder resist stripping potion (the temperature of the solder resist stripping potion is 75-85°C.);

[0046] Step 4, put the bad board and the socket into the liquid medicine tank, and soak...

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Abstract

The invention relates to a method for removing solder resist film and a solution for removing solder resist film, which is carried out according to the following steps: step 1, prepare defective boards; step 2, put defective boards into racks; Check the temperature of the solder resist film removal solution; step 4, put the bad board and the rack into the potion tank, and soak for T1 time continuously; step 5, put the bad board and the rack into the first washing pool equipped with an ultrasonic device, and wash it with water. Soak for T2 time; step 6, put the bad board and the insert into the second washing pool, wash and soak for T3 time; step 7, transfer the bad board to the first drying process, and dry it with strong hot air; step 8, the bad board The board enters the second drying process and is dried with hot air; step 9, the defective board enters the cold air cooling process for cooling treatment; step 10, the board is collected. The invention shortens the backwashing time by 40 minutes, improves the efficiency, reduces the backwashing temperature, saves energy, improves the quality, and cleans the inside of the 0.2mm via hole.

Description

technical field [0001] The invention relates to the technical field of power circuits, in particular to a solder resist film removal method and a solder resist film removal solution. Background technique [0002] With the development trend of miniaturization and high density of electronic products, the aperture of the via hole is getting smaller and smaller, and the requirements for rework (rework) of solder mask stripping are getting higher and higher. When PTH (PTH is the abbreviation of Plated Through Hole, plated through hole is the meaning of metallized hole) via hole <0.2mm, it is easy to cause abnormalities such as ink plugging and poor backwashing. [0003] In the existing process flow: bad board → insert frame → soaking in liquid medicine tank (time 50-60min, temperature 80-90℃) → washing soaking 1 (time 10min) → washing soaking 2 (time 10min) → high-pressure water gun washing → developing Punching (relative moving speed 1m / min) → plate collection (Note: The pot...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/28H05K3/00
CPCH05K3/288H05K3/0085H05K3/0088H05K2203/0793H05K2203/0756
Inventor 张雪锋郭小青何德海曾攀
Owner TEAN ELECTRONICS DA YA BAY CO LTD
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