The invention relates to a method for removing solder resist film and a solution for removing solder resist film, which is carried out according to the following steps: step 1, prepare defective boards; step 2, put defective boards into racks; Check the temperature of the solder resist film removal solution; step 4, put the bad board and the rack into the potion tank, and soak for T1 time continuously; step 5, put the bad board and the rack into the first washing pool equipped with an ultrasonic device, and wash it with water. Soak for T2 time; step 6, put the bad board and the insert into the second washing pool, wash and soak for T3 time; step 7, transfer the bad board to the first drying process, and dry it with strong hot air; step 8, the bad board The board enters the second drying process and is dried with hot air; step 9, the defective board enters the cold air cooling process for cooling treatment; step 10, the board is collected. The invention shortens the backwashing time by 40 minutes, improves the efficiency, reduces the backwashing temperature, saves energy, improves the quality, and cleans the inside of the 0.2mm via hole.