This invention discloses a method for manufacturing
shallow trench isolation, comprising: Step 1, performing a first
etching process on a
semiconductor substrate in the shallow trench formation area using a
dry etching process to form a shallow trench; during the first
etching,
metal ions are precipitated in the
dry etching process cavity and deposited on the inner surface of the shallow trench, and the
metal ions diffuse and form a
contamination layer; Step 2, performing a second
etching process on the
semiconductor substrate exposed on the inner surface of the shallow trench using a wet etching process to remove the
contamination layer on the inner surface of the shallow trench. This invention can remove the
metal ions precipitated in the
dry etching process cavity and deposited on the inner surface of the shallow trench during the dry etching process, thereby avoiding the
impact of metal ions on the yield of products, especially
CMOS image sensors.