Method for cleaning micro-nano particles through shock waves induced by spatially constrained double-beam laser

A micro-nano particle, laser-induced technology, applied in cleaning methods and utensils, chemical instruments and methods, etc., can solve the problems of small cleaning area and low cleaning efficiency, achieve enlarged cleaning area, convenient control, and avoid direct interaction Effect

Inactive Publication Date: 2021-08-03
ZHEJIANG UNIV OF TECH
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Recent studies have found that double-pulse induced plasma cleaning technology can effectively suppress the formation of uncleaned blind areas in single-pulse laser-induced plasma shock wave cleaning, but it does not solve the problem of small cleaning areas
Invention patent 200810165891.0 "Method and device for cleaning substrates" proposes a laser-induced shock wave cleaning method with inner chamber constraints, which has the disadvantages of small cleaning area and low cleaning efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for cleaning micro-nano particles through shock waves induced by spatially constrained double-beam laser

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be further described below in conjunction with the accompanying drawings.

[0025] refer to figure 1 , a space-constrained double-beam laser-induced shock wave cleaning method for micro-nano particles, the method comprising the following steps:

[0026] 1), bonding the substrate to be cleaned on the three-dimensional mobile platform 10, and moving the three-dimensional mobile platform 10 so that the substrate to be cleaned is located at the focal point of the laser pulse and at the exit of the cavity;

[0027] 2), using the first pulsed laser beam and the second pulsed laser beam to focus in the cavity to induce gas breakdown to generate a plasma shock wave, and the intensity of the shock wave is enhanced by reflection on the inner surface of the cavity, so that the micro-nano particle pollutants on the surface of the substrate to be cleaned Fly away from the surface of the substrate to be cleaned under the action of shock wave removal force....

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to view more

Abstract

A method for cleaning micro-nano particles through shock waves induced by spatially constrained double-beam laser comprises the following steps that (1), a to-be-cleaned substrate is bonded to a three-dimensional moving platform, and the three-dimensional moving platform is moved to enable the to-be-cleaned substrate to be located at a laser pulse focus point and a cavity outlet; and (2), a first pulse laser beam and a second pulse laser beam are focused in a cavity to induce gas breakdown to generate plasma shock waves, the strength of the shock waves is enhanced through reflection of the inner surface of the cavity, and the micro-nano particle pollutants on the surface of the to-be-cleaned substrate fly away from the surface of the to-be-cleaned substrate under the action of shock wave removal force. The method for cleaning the micro-nano particles through the shock waves induced by the spatially constrained double-beam laser can effectively increase the cleaning area of the surface of a substrate and improve the cleaning efficiency.

Description

technical field [0001] The invention relates to surface cleaning technology, in particular to a method for cleaning micro-nano particles with space-constrained double-beam laser-induced shock waves. Background technique [0002] As the size of chip units continues to shrink (DRAM half-pitch is expected to reach 14nm in 2021), the size of contamination particles on the surface of silicon wafers to be cleaned has been smaller than 10nm. Particulate pollutants will reduce the performance of integrated chips, micro-machines, precision optical components and other products in the IC industry, and in severe cases will lead to product failure. Traditional mechanical cleaning and chemical cleaning methods (mechanical scrubbing, chemical solution immersion, ultrasonic cleaning, etc.) have the disadvantages of destroying the substrate and secondary pollution, and these methods have low cleaning efficiency for particles with a diameter of less than 100nm. [0003] Laser-induced plasma...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B08B13/00
CPCB08B7/0042B08B13/00
Inventor 范丽莎姚建华张群莉张硕文
Owner ZHEJIANG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap