Preparation method of polishing disc for polishing superhard substrate slice and precise polishing method

A technology for polishing discs and negatives, applied in grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of time-consuming and labor-intensive, difficult to control and guarantee the processing quality of substrate sheets, increase costs, etc., and achieve an average thickness Small difference, reduced mechanical polishing time, cost saving effect

Active Publication Date: 2021-08-06
NANTONG UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is not only time-consuming and labor-intensive, but also increases costs, and the processing quality of the processed substrates is difficult to control and guarantee

Method used

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  • Preparation method of polishing disc for polishing superhard substrate slice and precise polishing method
  • Preparation method of polishing disc for polishing superhard substrate slice and precise polishing method
  • Preparation method of polishing disc for polishing superhard substrate slice and precise polishing method

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preparation example Construction

[0033] Aiming at the above-mentioned difficulties existing in the prior art, the present invention provides a method for preparing a polishing disc for superhard substrate polishing, such as figure 1 As shown, by using a multi-layer composite polishing disc to precisely polish the substrate, compared with the traditional substrate polishing process, the process flow is greatly simplified, and a substrate polishing sheet with a better surface shape is obtained. The polished substrate The average thickness difference is small, and the bending warpage is low.

[0034] The three-inch superhard silicon carbide substrate sheet adopts the three-layer composite polishing disc of the present invention to carry out precision mechanical polishing, and the abrasive material of the three-layer polishing disc is 1 micron, 3 micron and 6 micron diamond and percent of 60 volume percent Alumina with the same particle size of 10% by volume is sintered by ball milling and sintering polyester mat...

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Abstract

The invention relates to a preparation method of a polishing disc for polishing a superhard substrate slice and a precise polishing method, and belongs to a substrate machining technology. According to the novel preparation method of the polishing disc for polishing the substrate slice, the multi-layer composite polishing disc is used for precisely polishing the substrate slice, compared with a traditional substrate slice polishing technology, the technological process is greatly simplified, the polished substrate slice with the good surface type is obtained, and the polished substrate slice is small in average thickness difference and low in bending warping degree. The method is simple in process and easy to operate.

Description

technical field [0001] The invention relates to the technical field of substrate polishing, in particular to a preparation method and a precision polishing method of a polishing disk for superhard substrate polishing. Background technique [0002] Substrate is an important basic material in the semiconductor industry. The general preparation process is to grow crystals in gas phase or liquid phase, and then cut, grind, polish, and chemical mechanical polish the crystals. After cleaning and packaging, the crystals can be used for epitaxy. out-of-the-box substrate sheets. The epitaxial process of the substrate requires the substrate to have no damage or scratch on the surface, small thickness difference, small bending and warpage, and good surface flatness. [0003] The two parts of crystal growth technology and substrate cutting and processing technology are indispensable for the final shaping and use of the substrate, and the processing technology of the substrate is the gu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00B24B1/00
CPCB24D18/0009B24B1/00Y02P70/10
Inventor 李祥彪仲崇贵
Owner NANTONG UNIVERSITY
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