[0034] The embodiment of the present invention provides a method of preparation of a touch panel. figure 1 It is a flow chart of the preparation method of a touch panel according to an embodiment of the present invention, such as figure 1 As shown, the preparation method of the touch panel of the present embodiment includes the steps of:
[0035] S101 provides a substrate.
[0036] S102, forming a first structural layer and a second structural layer that are sequentially away from the substrate on the substrate; the first structural layer and the second structural layer form an underground channel structure; the underground channel structure includes the first channel opening, intermediate The channel and the second channel opening; the first structural layer is formed with an intermediate passage; the second structural layer forms a first channel opening and a second channel opening, and a bridge structure is formed between the first channel opening and the second channel opening.
[0037] figure 2 It is a schematic structural diagram of a first structural layer and a second structural layer provided in the embodiment of the present invention. image 3 Yes figure 2 Schematic diagram of the cross-sectional structure along section A-A ', reference figure 2 and image 3 First, the substrate 11 is provided, and the underground channel structure 14 is formed by the first structural layer 12 and the second structural layer 13 on the substrate 11. The underground passage 14 includes a first passage opening 131, an intermediate passage 121, and a second channel opening 132 in which it are sequentially communicated. like Figure 4 Distance Figure 4 Yes figure 2 A structural diagram of the first structural layer, in this embodiment, the intermediate channel 121 is disposed in the first structural layer 12, such as figure 2 As shown, the first channel opening 131 and the second channel opening 132 are both provided in the second structural layer 13, and a bridge structure 133 is formed between the first passage opening 131 and the second channel opening 132 of the second structural layer 13, Or figure 2 As shown in the plane parallel to the substrate 11, the bridge structure 133 is located above the intermediate passage 121 and across the sides of the width direction of the intermediate passage 121.
[0038] S103, a conductive layer is deposited on the second structural layer; the conductive layer penetrates into the intermediate passage through the first passage opening and the second channel opening.
[0039] exist figure 2 and image 3 The first structural layer 12 and the second structural layer 13 deposits the conductive layer, such as Figure 5 Distance Figure 5It is a schematic cross-sectional structure of a deposition conductive layer on the second structural layer according to an embodiment of the present invention. The conductive layer 15 is prepared to be prepared on the substrate 11, the first structural layer 12, and the second structural layer 13, and the conductive layer 15 may be aluminum, titanium aluminum, or other metal, or indium oxide (Indium Tin Oxide). , ITO, other conductive oxides, as long as the conductivity can meet the touch requirements. In this embodiment, the conductive layer 15 can be formed by sputtering method, and the underground passage structure 14 formed by the first structural layer 12 and the second structural layer 13, the sputter atoms form the conductive target of the conductive layer 15 will deposit The upper surface of the bridge 133 and the lower side of the underground passage structure 14. The principle of deposition in the underground channel structure 14 is a shadow shadow effect, and there are a variety of sputtering atoms to reach the underground channel structure 14. For example, the first type: the collision between the collisions or magnetic fields between the sputter atoms causes a partial sputter atom to be incident in the intermediate channel 121 under the bridge structure 133 and deposit; the second: hit the first channel opening 131 or The sidewall 13a of the second passage opening 132 and the sputter atom of the side wall 12a of the intermediate passage 121 can be bounced into the intermediate channel 121 under the bridge 133.
[0040] S104, patterned the conductive layer to form a first electrode, a second electrode, and a conductive layer located on the side of the bridge structure, and the adjacent first electrode The first connection portion is electrically connected, and the adjacent second electrode is electrically connected by a second connection portion formed from a conductive layer in the intermediate channel.
[0041] Image 6 It is a schematic structural diagram of a touch panel provided by the embodiment of the present invention. Figure 7 Yes Image 6 A cross-sectional structure of the tactile panel along line B-B '. The conductive layer 15 is patterned to form an insulating first electrode 151 and the second electrode 152, the first electrode 151, and the second electrode 152 is a touch drive electrode, and the other is a touch sensing. The electrodes are fitted to achieve the mutual capacitance touch of the touch panel to determine the touch position.
[0042] The bridge-like structure 133 diffuses from the conductive layer on the side of the substrate 11 to form the first connecting portion 153, penetrate into the conductive layer in the intermediate passage 121 form a second connecting portion 154, adjacent the first electrode 151 can pass through the bridge structure. The first connecting portion 153 on 133 is connected, and adjacent second electrodes 152 can be connected via the second connecting portion 154 in the intermediate channel 121. The first connecting portion 153 and the second connecting portion 154 are respectively disposed on both sides of the bridge structure 133, and electrically insulated from each other without interfering with each other, effectively avoiding the first electrode 151 and the second electrode 152 between the first electrode 151 and the second electrode 152. There is a problem such as short circuit or signal interference. Further, in the present embodiment, the first electrode 151, the second electrode 152, the first connecting portion 153, the second connecting portion 154 are used by the primary conductive layer 15, and the second connecting portion 154, that is, an interactive touch electrode. The touch panel, and the touch panel of the mutual capacitance touch electrode in the prior art requires deposition and patterning treatment of the two conductive layers, wherein the deposition and patterning process of the primary conductive layer is used to form a touch electrode. The deposition of the other conductive layer and the patterning process are used to form a transparo layer to which the touch control electrode is connected, and the present embodiment can form a bridge structure through the deposition and patterning of the primary conductive layer, which is compared to the above-described prior art. 133 Upside down two-layer metal insulation to prepare a cross-sectional intersecting touch electrode structure, effectively simplifying the process flow, reducing the desired conductive layer 15 deposition molding and patterning, saving process and consumables.
[0043] Optionally, the extended direction of the second connecting portion 154 and the extension direction of the bridge 133 intersects, in particular, the extension direction of the second connecting portion 154 and the extended direction of the bridge structure 133 is perpendicular to the adjacent The second electrode 152 is connected to avoid interference with the first electrode 151.
[0044] The touch panel preparation method in the present invention is provided on the substrate, and the first structural layer and the second structural layer in which the substrate are sequentially away, and the underground channel structure is formed by the first structural layer and the second structural layer. The intermediate channel in the underground channel structure is formed, and the second structural layer forms a first channel opening and the second channel opening in the underground channel structure, and also forms a bridge structure between the first channel opening and the second channel opening. A channel opening, an intermediate passage, and a second channel opening are connected, and a bridge structure is formed on the intermediate channel, and the conductive layer is deposited on the second structural layer to form an insulating first electrode and the second electrode, the conductive layer can be simultaneously Deposited into the bridge structure and the intermediate passage, and realizes the insulation of the upper and lower conductive layers on the channel, and the bridge structure can be formed, and the second connection portion is formed in the intermediate channel, and the adjacent first electrode passes the first The connecting portion is connected, adjacent the second electrode is connected by the second connection portion. During the preparation of the touch panel, only the deposition of the primary conductive layer is required, that is, the structure of the cross-sectional intelliral touch electrode structure can be formed, which reduces the conductive layer deposition required for the structure of the conveyor of the touch electrode structure. The number of molding and patterning treatment, the structure is simple, simplified the process process, saves consumables, and effectively improves the productivity of the touch panel.
