Building structure analysis system based on BIM technology
A technology for analyzing systems and building structures, which is applied in the field of building structure analysis systems based on BIM technology, can solve problems such as complicated work procedures, high testing costs, and low testing accuracy, so as to save manpower and material resources, reduce construction difficulty, and enhance reliability Effect
Pending Publication Date: 2021-08-10
王朝景
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Problems solved by technology
[0004] In order to solve the problems of complex working procedures of the equipment for the detection method of construction engineering structure, too much auxiliary work required, time-consuming and laborious, high detection cost and low detection accuracy, the purpose of the present invention is to provide a building structure analysis system based on BIM technology
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[0027] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.
[0028] see Figure 1 to Figure 3 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the sa...
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The invention discloses a BIM technology-based building structure analysis system, which comprises a laser emission module and a monitoring module, and is characterized in that the monitoring module is connected with a background BIM processing analysis system through a wireless transmission technology, the laser emission module comprises a first processor, the first processor is connected with a first power supply unit, a horizontal sensor, a leveling support mechanism and a collimation laser emission unit, the monitoring module comprises a monitor installed on a building and used for receiving a laser beam, the monitor is connected with a second processor, the second processor is connected with a CPLD and DSP image acquisition unit and a wireless data transmission unit, and the monitor comprises a light transmitting sheet, a light filter, a light splitting sheet and two CCD imaging units. The invention relates to the technical field of building structure safety monitoring. According to the invention, the problems of complicated equipment working procedures, too much required auxiliary work, time and labor consumption, high detection cost and low detection precision of a construction engineering structure settlement detection method are solved.
Description
technical field [0001] The invention relates to the technical field of building structure safety monitoring, in particular to a building structure analysis system based on BIM technology. Background technique [0002] During the construction and use of construction projects, along with the increase of foundation load and other factors, the main body of the building will have a certain degree of settlement. As a comprehensive project, the monitoring of building settlement parameters involves building construction, use and Maintenance and other stages are of great significance to the safe operation of buildings. [0003] In the prior art, the construction engineering structure settlement detection method equipment working procedures are complicated, too much auxiliary work is required, time-consuming and labor-intensive, the detection cost is high and the detection accuracy is low, so that the monitoring of most buildings only stays on the surface inspection, and often In-dep...
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Patent Timeline
Login to View More IPC IPC(8): G01C5/00G01C15/00G06F30/13G06Q10/06G06Q50/08
CPCG01C5/00G01C15/002G06Q10/0635G06Q50/08G06F30/13
Inventor 王朝景
Owner 王朝景