A method for preparing high-precision circuit of rigid-flex board
A rigid-flex board, high-precision technology, applied in printed circuit manufacturing, multi-layer circuit manufacturing, chemical/electrolytic method to remove conductive materials, etc., can solve uneven copper reduction, unreasonable line compensation, and affect product production Efficiency and other issues to achieve the effect of ensuring yield
Active Publication Date: 2021-09-28
GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD
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Problems solved by technology
The pure subtractive process can no longer meet the product demand, and the MSAP process is more favored by PCB companies. When the pure MSAP process is used to produce such line grades, it will cause uneven copper reduction and unreasonable line compensation, resulting in line dog teeth, Product abnormalities such as short circuit and open circuit directly affect the production efficiency of the product, and there are risks of high rework rate and quality loss
Method used
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Embodiment Construction
[0016] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all Example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0017] The invention proposes a method for preparing a high-precision circuit of a rigid-flex board, comprising the following steps:
[0018] S1: After finishing the inner layer, carry out copper foil lamination and PET film removal, use chemical organic liquid to remove thick copper, and increase whitening process to reduce copper;
[0019] S2: Use ultraviolet laser UV drilling, and sequentially perform plasma degumming, black hole pro...
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The invention provides a method for preparing a high-precision circuit of a rigid-flexible board, which optimizes the MSAP process by adding a whitening process and inverse compensation for the cumulative error of the resolution of an LDI exposure machine. Among them, the whitening process includes washing foreign matter on the surface of the PCB by acid-base potion, while not increasing the roughness of the copper surface, the copper surface is activated, and the copper is uniformly reduced to ensure that the surface of copper ions is more likely to escape under the excitation of ultraviolet light waves. surface. During LDI exposure, further according to the resolution requirements of the dry film, combined with the resolution of the LDI exposure machine, at least one pixel is reduced to perform reverse compensation of the exposure line size, thereby ensuring the yield rate of the line.
Description
technical field [0001] The invention relates to the technical field of circuit board manufacture, in particular to a method for preparing a high-precision circuit of a rigid-flex board. Background technique [0002] With the rapid development of electronic communications, in order to meet the needs of miniaturization of electronic equipment, printed circuit boards (PCBs) are gradually developing towards high-precision circuits. With the upgrade of the line level, especially the line level breaks through 30 / 30μm. The pure subtractive process can no longer meet the product demand, and the MSAP process is more favored by PCB companies. When the pure MSAP process is used to produce such line grades, it will cause uneven copper reduction and unreasonable line compensation, resulting in line dog teeth, Product abnormalities such as short circuit and open circuit directly affect the production efficiency of the product, and there are risks of high rework rate and quality loss. C...
Claims
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IPC IPC(8): H05K3/46H05K3/00H05K3/06
CPCH05K3/4691H05K3/0005H05K3/4652H05K3/067H05K3/0026H05K2203/107H05K2203/0502
Inventor 郑海涛王康兵莫欣满张鉴泽
Owner GUANGDONG KINGSHINE ELECTRONICS TECH CO LTD