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Shielding mechanism with silver film structure, forming jig and forming method

A molding method and silver film technology, which is applied in the electrical field, can solve problems such as signal leakage, affecting stripping efficiency, and appearance defects, and achieve the effect of reducing waste and improving stripping efficiency

Inactive Publication Date: 2021-08-13
FOREWIN FPC SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the above-mentioned production and processing process, after the shielding unit is fixed to the external circuit board, the release layer needs to be peeled off. Since the release layer and the silver film shape are adapted to each other, it is necessary to use external force to penetrate into the interlayer between the two. During the peeling action, the above-mentioned process is likely to cause defects in the appearance of the silver film, which affects the peeling efficiency
Appearance defects may affect signal leakage, and may also cause problems such as co-adjacent channel interference

Method used

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  • Shielding mechanism with silver film structure, forming jig and forming method
  • Shielding mechanism with silver film structure, forming jig and forming method
  • Shielding mechanism with silver film structure, forming jig and forming method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] combine figure 1 As shown, this embodiment provides a shielding mechanism with a silver film structure, including a shielding unit, a body unit 1 and a drainage unit 2 .

[0045] The shielding unit includes a silver film layer 3, a conductive adhesive layer 4 and a release layer 5, which are stacked in a shape-adaptive manner during the production process. Specifically, the conductive adhesive layer 4 is located on the silver film layer. 3, the release layer 5 is located above the silver film layer 3. The above-mentioned silver film layer 3 can effectively play a shielding role. In the subsequent process of peeling off the release layer 5, it is also necessary to ensure the surface quality of the silver film layer 3, thereby avoiding or reducing the problem of co-adjacent frequency interference. .

[0046] In this embodiment, the thickness of the silver film layer 3 is between 8-12 μm, the thickness of the conductive adhesive layer 4 is also between 8-12 μm, and the t...

Embodiment 2

[0052] The structure of this embodiment is basically the same as that of Embodiment 1, the difference is that;

[0053] combine figure 2 As shown, the right corner of the conductive adhesive layer 4 and the corresponding silver film layer 3 can be cut off a part by a cutter device, so that there is an effective gap between the release layer 5 and the FPC board, so as to A drainage unit 2 is formed. The release layer 5 can be better peeled off relative to the silver film layer 3 by the airflow acting on the above-mentioned gap.

Embodiment 3

[0055] The invention also discloses a molding jig for the shielding mechanism, which includes a positioning lower mold 6, a positioning upper mold 7, a heating device, an attaching device and a blowing device. Wherein the lower positioning die 6 and the upper positioning die 7 are arranged facing each other, preferably, the lower positioning die 6 and the upper positioning die 7 can act on the body unit 1 (FPC board) and the shielding unit in a horizontal plane.

[0056] In the above manner, the positioning lower die 6 can complete the support and positioning of the FPC board in the horizontal plane; the positioning upper die 7 can complete the grasping and transfer of the shielding unit, and can move towards the FPC board, and then The conductive adhesive layer 4 of the shielding unit can be attached to the FPC board, and the attachment accuracy of the two can be guaranteed.

[0057] In the above manner, the positioning upper mold 7 includes an upper mold body and a negative ...

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Abstract

The invention discloses a shielding mechanism with a silver film structure, a forming jig and a forming method. The shielding mechanism comprises a shielding unit, a body unit and a drainage unit. The shielding unit comprises a silver film layer, a conductive adhesive layer and a release layer, and the first surface of the body unit is arranged towards the conductive adhesive layer, so that the conductive adhesive layer can be adhered to the body unit; the drainage unit comprises a non-cohesive adhesive layer, and the non-cohesive adhesive layer is arranged between the body unit and the conductive adhesive layer and located at at least one corner of the conductive adhesive layer; or the release layer can form the drainage unit after the conductive adhesive layer corresponding to the release layer is cut off; and the release layer can be separated from the silver film layer after the airflow acts on the drainage unit. Through the arrangement of the drainage unit, the release layer can be directly and effectively stripped relative to the silver film layer under the action of airflow.

Description

technical field [0001] The invention relates to the field of electrical technology, in particular to a shielding mechanism with a silver film structure, a molding jig and a molding method. Background technique [0002] With the development of shielding film applications, more and more electronic products need to use shielding film units. At present, the commonly used shielding unit is shielded by silver film. During the production and processing of the silver film, in order to ensure that it can be effectively connected with external parts and protect its own structure, glue is usually provided on both surfaces of the silver film. layer and release layer. [0003] In the above-mentioned production and processing process, after the shielding unit is fixed to the external circuit board, the release layer needs to be peeled off. Since the release layer and the silver film shape are adapted to each other, it is necessary to use external force to penetrate into the interlayer be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00B29C65/14B29C65/74B32B3/08B32B7/06B32B7/12B32B15/04B32B33/00B29L7/00B29L9/00
CPCB29C65/1412B29C65/74B29L2007/00B29L2009/00B32B3/08B32B7/06B32B7/12B32B15/04B32B33/00B32B2307/212B32B2457/00H05K9/0084
Inventor 皇甫铭吴鹏
Owner FOREWIN FPC SUZHOU