A topology optimization method and system for electronic wiring harness

Abstract

The present invention provides a method and system for topology optimization of an electronic wiring harness. The method includes: obtaining a continuous solid model and material parameters of the insulating protection layer; determining a design area, and dividing the continuous solid model into grids according to the design area , to obtain a grid model; based on the grid model, a topology optimization model is established, and the topology optimization model takes the minimum material cost of the insulating protection layer as the objective function, and uses the first insulating material and / or the second 2. The open distribution of the insulating material is the design variable, and the insulation strength, aging speed and mechanical properties are the constraints; the topology optimization model is optimized and updated according to the finite element analysis, and iterated until the topology optimization model meets the convergence condition, the optimized design variables are obtained. The invention can reduce the amount of insulating material and improve the service life of the electronic wiring harness.

Description

technical field [0001] The invention relates to the field of electronic wire harnesses, in particular to a topology optimization method and system for electronic wire harnesses. Background technique [0002] A wire harness is a group of metal wires and cables tied together to carry the signal and power connections to and from equipment. For multi-conductor wire harnesses, in order to ensure the formability and reduce the shape, it is generally necessary to twist the wires. Due to the large pitch diameter of the twist, most of the wires are twisted without back-twisting, so that the wires are tightly twisted together. However, twisting the core wires together in this way will change the physical properties of the core wires. For example, due to the twisting of the insulating layer on the surface of the wire, a certain stress concentration phenomenon on the surface will occur and persist for a long time, which will reduce the physical properties of the insulating layer. Agein...

AI Technical Summary

Problems solved by technology

Twisting the core wires together in this way will change the physical properties of the core wires. For example, due to the twisting of the insulating layer on the surface of the wire, a certain stress concentration phenomenon on the surface will occur and last for a long time, which will reduce the physical properties of the insulating layer and make it easier Ageing

And some other ways are to integrate the insulation layer of multiple wires, but in this way, there will be redundancy of materials and the cost will increase

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