Micro-element capable of being transferred in massive scale, manufacturing and transferring method thereof and display device

Abstract

The invention provides a micro-element capable of being transferred in a massive scale, a manufacturing and transferring method of the micro-element and a display device. The micro-element comprises a light-emitting structure, wherein the light-emitting structure comprises a plurality of LED core particles which are isolated from one another through grooves, and each LED core particle comprises an epitaxial lamination layer, a chain layer, an insulation protection layer, a first electrode and a second electrode; the LED core particles are embedded into the grooves through a bonding layer, so that the LED core particles are hung upside down and suspended above a supporting substrate; a local area of the epitaxial lamination layer is etched to part of the first type semiconductor layer to form a groove and a table board; the chain layer is stacked on the table board and extends to the grooves in the two sides of the corresponding LED core particles; and the insulating protection layer covers each LED core particle and the corresponding chain layer, and exposes part of the surface of the table board and part of the surface of the groove corresponding to each LED core particle respectively.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a mass-transferable micro element, a manufacturing and transferring method thereof, and a display device. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is ho...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a micro-element that can be transferred in large quantities, its manufacturing and transfer method, and a display device, so as to solve the problems caused by the residual insulating protective layer around the LED core grain in the prior art

Images