Micro-element capable of being transferred in massive scale, manufacturing and transferring method thereof and display device

A manufacturing method and technology of micro-components, applied in the fields of electrical components, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve problems such as residual insulating protective layer

Pending Publication Date: 2021-08-20
XIAMEN QIANZHAO SEMICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a micro-element that can be transferred in large quantities, its manufacturing and transfer

Method used

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  • Micro-element capable of being transferred in massive scale, manufacturing and transferring method thereof and display device
  • Micro-element capable of being transferred in massive scale, manufacturing and transferring method thereof and display device
  • Micro-element capable of being transferred in massive scale, manufacturing and transferring method thereof and display device

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Embodiment Construction

[0057] In order to make the content of the present invention clearer, the content of the present invention will be further described below in conjunction with the accompanying drawings. The invention is not limited to this specific example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0058] Such as image 3 As shown, a mass-transferable micro-element includes:

[0059] a supporting substrate 12 and a bonding layer 11 disposed on the surface of the supporting substrate 12;

[0060] A light-emitting structure, the light-emitting structure includes a number of LED chips L isolated from each other through the groove L3; and each LED chip L is embedded in the groove L3 through the bonding layer 11, so that the LED chip L hangs upside down above the support substrate 12;

[0061] Wherein, each LED chip L includes ...

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Abstract

The invention provides a micro-element capable of being transferred in a massive scale, a manufacturing and transferring method of the micro-element and a display device. The micro-element comprises a light-emitting structure, wherein the light-emitting structure comprises a plurality of LED core particles which are isolated from one another through grooves, and each LED core particle comprises an epitaxial lamination layer, a chain layer, an insulation protection layer, a first electrode and a second electrode; the LED core particles are embedded into the grooves through a bonding layer, so that the LED core particles are hung upside down and suspended above a supporting substrate; a local area of the epitaxial lamination layer is etched to part of the first type semiconductor layer to form a groove and a table board; the chain layer is stacked on the table board and extends to the grooves in the two sides of the corresponding LED core particles; and the insulating protection layer covers each LED core particle and the corresponding chain layer, and exposes part of the surface of the table board and part of the surface of the groove corresponding to each LED core particle respectively.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to a mass-transferable micro element, a manufacturing and transferring method thereof, and a display device. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is ho...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L27/15
CPCH01L21/67144H01L27/156
Inventor 江方吴双冯妍雪柯志杰艾国齐
Owner XIAMEN QIANZHAO SEMICON TECH CO LTD
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