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A vertical interconnection structure and welding method at the bottom of a multilayer microstrip printed antenna

A vertical interconnection and microstrip technology, which is applied in the direction of antenna grounding device, welding equipment, radiation element structure, etc., can solve the problems of reduced electrical conductivity, reduced adhesive force, and antenna circuit chip falling off, so as to reduce the difficulty of assembly and welding , Prevent short circuit or open circuit, avoid attenuation and loss effect

Active Publication Date: 2022-05-17
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Structurally, the protruding structure of the coaxial joint with flange hinders the integration of the microstrip antenna, which is not conducive to the miniaturization of the structure
[0006] In the assembly process, there are problems of high void rate, aging, and long-term reliability in the bonding of conductive adhesives. When working for a long time in a non-protective atmosphere environment, the electrical conductivity will gradually decrease, the resistance will increase and the adhesion will decrease, and even the antenna circuit chip will be damaged. Shedding and other phenomena
[0007] Therefore, there are defects in the existing interconnection structure of coaxial probes at the bottom of the printed antenna. Not only the overall structure is difficult to meet the requirements of miniaturization and integration, but also the performance is difficult to meet the requirements of radiation and stealth. These are urgently needed to be improved. Therefore, the structure of the printed antenna should be optimized and improved to improve the overall performance of the printed antenna and meet the current development needs of the printed antenna. Therefore, it is necessary to propose a more reasonable technical solution to solve the shortcomings of the existing technology.

Method used

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  • A vertical interconnection structure and welding method at the bottom of a multilayer microstrip printed antenna
  • A vertical interconnection structure and welding method at the bottom of a multilayer microstrip printed antenna
  • A vertical interconnection structure and welding method at the bottom of a multilayer microstrip printed antenna

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Embodiment 1

[0039] In view of the current situation that the structure of the existing multi-layer microstrip printed antenna is difficult to be miniaturized and integrated, and the radiation performance and stealth performance of the antenna are difficult to be satisfied, this embodiment presents an optimized bottom vertical interconnection structure , to solve the deficiencies in the antenna structure.

[0040] Specifically, the technical solution adopted in this embodiment is as follows:

[0041] Such as figure 1 As shown, a vertical interconnection structure at the bottom of a multilayer microstrip printed antenna includes a metal carrier 1 on which a multilayer microstrip printed circuit chip 3 is arranged; the metal carrier 1 is provided with a coaxial connection device 2, a coaxial connector center conductor 4 is arranged between the metal carrier 1 and the multilayer microstrip printed circuit sheet 3, and one end of the coaxial connector center conductor 4 is connected to the co...

Embodiment 2

[0058] The content of the above-mentioned embodiment discloses the overall composition structure of the printed antenna. This embodiment also specifically discloses the welding method of the vertical interconnection structure at the bottom of the printed antenna. The specific technical solution adopted is as follows:

[0059] Such as figure 2 As shown, a welding method for the vertical interconnection structure at the bottom of a multilayer microstrip printed antenna, including:

[0060] S01: Use medium and high temperature solder to weld the coaxial connector on the metal carrier, and the medium and high temperature solder is preset at the end of the coaxial connector;

[0061] S02: apply low-temperature soldering material on the lower surface of the multilayer microstrip printed circuit chip by stencil printing, and pre-set the feeding interconnection solder on the inner surface of the feeding hole;

[0062] S03: Lay and press the multi-layer microstrip printed circuit chi...

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Abstract

The invention relates to the technical field of antenna feed interconnection, in particular to a vertical interconnection structure at the bottom of a multilayer microstrip printed antenna and a welding method. The invention improves the vertical interconnection structure at the bottom of a multilayer microstrip printed antenna, Optimize the connection structure of the circuit chip, metal carrier, etc., while performing coaxial vertical interconnection, it can also avoid structural interference at the connection of the coaxial connector, which is conducive to the integrated integration and miniaturization of the overall structure, and improves The final structure also avoids performance attenuation and loss, and can guarantee reliability even if it is used for a long time. All structural connections and electrical connections are processed with solder, which realizes the integration of structure and function and improves reliability. The multi-step gradient matching welding method is adopted to reduce the difficulty of assembly welding and prevent short circuit or open circuit caused by solder remelting.

Description

technical field [0001] The invention relates to the technical field of antenna feed interconnection, in particular to a vertical interconnection structure at the bottom of a multilayer microstrip printed antenna and a welding method. Background technique [0002] With the development of phased array systems towards miniaturization, high-density integration, array and stealth, microstrip printed antennas are widely used in phased array systems. There are two types of printed antenna interconnects: side interconnects and bottom vertical interconnects. Among them, the vertical interconnection at the bottom of the printed antenna generally adopts the method of coaxial probe interconnection. [0003] At present, the interconnection method of the coaxial probe at the bottom of the printed antenna generally adopts that the side of the ground plate of the antenna is bonded to the metal carrier with conductive adhesive, and the coaxial joint with the flange is fastened on the metal ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01Q1/38H01Q1/48B23K1/00
CPCH01Q1/38B23K1/0008H01Q1/48B23K2101/36B23K2101/42
Inventor 何国华张涛常义宽周凤龙谷岩峰李甫迅徐海洋
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP