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Welding clamping tool for chip-level circuit board

A technology of circuit boards and welding clips, which is applied to printed circuits, welding equipment, auxiliary welding equipment, etc., can solve the problems of poor production consistency, cumbersome operation, and low use efficiency, and achieve the effect of convenient disassembly and assembly

Active Publication Date: 2021-08-27
SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing welding fixtures use various screws in the process of parts loading and unclamping, and the operation is relatively cumbersome; the use efficiency is low; and it is difficult to ensure the consistency of the pressing force, resulting in certain differences in product welding quality , poor production consistency

Method used

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  • Welding clamping tool for chip-level circuit board
  • Welding clamping tool for chip-level circuit board
  • Welding clamping tool for chip-level circuit board

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach

[0061] Specific implementation method: Place the carrier plate 1 of the circuit board in the receiving groove 111, then place the solder piece, and then place the substrate 2 above the solder piece; Tighten the sides of the carrier board 1 and the substrate 2; place solder tabs on the substrate 2, and then place various devices 3 on the solder tabs. Rotate the pressing assembly 20, such as Figure 10 As shown, first the support plate 21 is in contact with the buckle seat 14 . At this time, the support plate 21 is parallel to the base 11, the first elastic element 23 has not applied pressure to the sliding part 30, the third elastic element 26 is stretched, and the first push rod 31 and the second push rod 32 are in contact with the device 3 and the substrate. 2 with a gap between them. Then continue to rotate the pressing plate 22 to make the pressing plate 22 parallel to the base 11, as Figure 11 As shown, the lower part of the buckle 24 is snapped into the bayonet 141 to...

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Abstract

The invention discloses a welding clamping tool for a chip-level circuit board. The welding clamping tool comprises a clamping component and a pressing component. The clamping component comprises a base, and the top face of the base is provided with two rotationally symmetrical containing grooves used for containing a circuit board; and a first sliding block and a second sliding block are arranged on the side wall of each containing groove respectively to press the circuit board. The pressing component is hinged to the upper portion of one end of the base, and a buckle base is arranged at the other end of the base. The pressing component comprises a supporting plate, a pressing plate and a sliding part, the supporting plate and the pressing plate are hinged to the base along the same axis, the sliding part penetrates through the supporting plate in the vertical direction, the pressing plate is located above the supporting plate and the sliding part, and a first elastic element is arranged between the sliding part and the pressing plate. A first ejector rod and a second ejector rod are arranged at the bottom of the sliding part. When the supporting plate makes contact with the buckle base, the first ejector rod and the second ejector rod are both perpendicular to the base. The pressing plate is provided with a rotatable buckle, and the buckle seat is provided with a bayonet. According to the welding clamping tool, the product can be quickly positioned, clamped and loosened; and clamping is stable and reliable.

Description

technical field [0001] The invention belongs to the technical field of chip-level circuit board welding technology, and in particular relates to a welding clamping tool for chip-level circuit boards. Background technique [0002] Compared with conventional circuit boards, chip-level circuits have smaller board volume and higher integration. Usually, multiple electronic components need to be integrated on smaller circuit board substrates, such as power control devices, switch control devices, capacitors, etc. . This type of chip-level circuit board usually includes a carrier board, a substrate, and various devices, and most of the parts are connected by high-temperature soldering. In the production process, it is necessary to use fixtures to fix each part to ensure production consistency. [0003] Most of the existing welding fixtures use various screws in the process of parts loading and unclamping, and the operation is relatively cumbersome; the use efficiency is low; and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08B23K37/04B23K101/42
CPCB23K3/087B23K2101/42
Inventor 肖飞雨
Owner SICHUAN SIAIPU ELECTRONICS TECH CO LTD
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