Planarization machining device and single-face and double-face planarization machining system

Abstract

The invention discloses a planarization machining device and a single-face and double-face planarization machining system. The planarization machining device comprises a plurality of permanent magnets used for forming a multi-point self-rotation array magnetic pole, array positive electrodes, array negative electrodes and electromagnetic rheologic fluid; the end faces of the permanent magnets are arranged in a parallel and level manner in the same direction or in different directions; the permanent magnets are arranged in a magnetic pole installing disk through magnetic pole installing end covers; the permanent magnets are correspondingly arranged at the first end of a rotating shaft; a polishing disk is installed on the magnetic pole installing disk; the second end of the rotating shaft is connected with a magnetic pole synchronous rotating motor used for driving the permanent magnets to rotate synchronously and a transmission system; the array positive electrodes and the array negative electrodes are arranged on the polishing disk; the array positive electrodes, the array negative electrodes and the magnetic pole installing disk are arranged in a mutual insulation manner; the array positive electrodes and the array negative electrodes are connected with a low-frequency high-voltage square wave alternating power source; the electromagnetic rheologic fluid is arranged in the polishing disk and mixed with abrasive materials; and the electromagnetic rheologic fluid forms a polishing pad under the coupling action of a dynamic magnetic field and a low-frequency high-voltage square wave alternating electric field. By means of the device, the planarization machining quality and efficiency of the surface of a workpiece is improved.

Description

technical field [0001] The invention relates to the technical field of ultra-precision processing equipment, in particular to a flattening processing device applied to semiconductor substrates. In addition, the present invention also relates to a single-side planarization processing system including the above-mentioned planarization processing device and a double-side planarization processing system including the above-mentioned planarization processing device, which are applied to semiconductor substrates. Background technique [0002] With the rapid development of microelectronics and optoelectronics technology, new-generation semiconductor substrates such as single crystal SiC, sapphire, and glass substrates are developing in the direction of large size and ultra-thinning, and the processing requirements for semiconductor substrates are also getting higher and higher. Not only The wafer is required to achieve sub-nanometer surface roughness, and the wafer is also required...

AI Technical Summary

Problems solved by technology

[0003] A typical flattening processing technology of semiconductor substrate surface is classical magnetorheological finishing (Magnetorheological Finishing, MRF). Point-by-point scanning processing, but the processing efficiency is relatively low

In the cluster magnetorheological flattening processing method, the small-sized magnetic body used to form the magnetorheological effect polishing pad usually adopts a permanent magnet. During the processing, the gap between the workpiece and the polishing disc can only be adjusted Gap) to adjust the stiffness of the polishing disc. At the same time, the cluster magnetorheological effect polishing pad formed by the static magnetic field lacks the mechanism of self-dressing and self-sharpening of the abrasive. The viscoelasticity of the magnetorheological fluid under the action of the magnetic field makes the static magnetic field form The polishing pad is deformed by force on the surface of the workpiece after processing, and it is difficult to keep the performance of the processed workpiece stable, which restricts the further application and development of this process

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