Preparation method of array substrate, array substrate and liquid crystal display panel
A technology of array substrates and substrate substrates, applied in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve problems that do not have practical applications, and achieve the effect of realizing manufacturing costs
Active Publication Date: 2021-08-31
HKC CORP LTD +1
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Problems solved by technology
[0005] However, the 3-pass photolithography technology in the prior art does not have the possibility of practical application, thus, there is an urgent need for a preparation method of an array substrate that can reduce the cost compared with the 4-pass photolithography technology
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[0038] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be described in further detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
[0039]Unless otherwise defined, technical terms or scientific terms used in this application shall have the usual meanings understood by those skilled in the art. The terms "first", "second", "third", "fourth" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Thus, a feature defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of these features. In the description of the embodiments of the present application, un...
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The invention provides a preparation method of an array substrate, the array substrate and a liquid crystal display panel, and relates to the technical field of display. The preparation method of the array substrate comprises the steps: sequentially depositing a first metal layer and a multi-thin-film layer on a substrate, carrying out a first photoetching process, and forming a first metal pattern layer and a multi-film pattern layer located on the first metal pattern layer; depositing a photoresist layer, performing a second photoetching process from one side, far away from the first metal pattern layer, of the substrate by taking the first metal pattern layer as a first mask plate, and removing the photoresist layer in contact with the substrate to form a photoresist pattern layer; depositing a first insulating layer, and stripping the photoresist pattern layer and the first insulating layer on one side, far away from the substrate, of the photoresist pattern layer. According to the preparation method, the first metal pattern layer etched after the first photoetching process is used as the mask plate of the second photoetching process, so that one mask plate can be saved, and the purpose of reducing the manufacturing cost of the array substrate is achieved.
Description
technical field [0001] The present application belongs to the field of display technology, and in particular relates to a preparation method of an array substrate, an array substrate and a liquid crystal display panel. Background technique [0002] Liquid crystal display panels (liquid crystal display, LCD) have the advantages of low radiation, small size and low energy consumption, and are widely used in various electronic devices such as notebook computers and televisions. [0003] A liquid crystal display panel generally includes an array substrate (thin film transistor, TFT), a color filter substrate (color filter, CF), a liquid crystal (liquid crystal, LC) sandwiched between the array substrate and the color filter substrate, and a sealant frame. [0004] In the prior art, the manufacturing technology of the array substrate has experienced from 7 times of lithography (7mask) to 5 times of lithography (5mask), then to 4 times of lithography (4mask), and 3 times of lithog...
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IPC IPC(8): H01L21/77H01L27/12G02F1/1362
CPCH01L27/1259H01L27/1288H01L27/1214H01L27/124G02F1/136231
Inventor 刘凯军周佑联刘振许哲豪郑浩旋
Owner HKC CORP LTD