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Photoelectric element packaging body and packaging structure thereof

A technology of optoelectronic components and packages, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve problems such as wiring, electrical failure, thermal shock resistance, reliability cracking, etc., to reduce packaging costs, maintain stability, and package good effect

Inactive Publication Date: 2021-09-03
北京燕园智产科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] With the continuous improvement of the wafer tape-out process level of optoelectronic devices, the number of pixels of a single chip is gradually increasing. Since the photosensitive components of optoelectronic device sensors are distributed on the front of the chip, the front of the wafer needs to be bonded to the transparent substrate. On the one hand, it ensures that the light enters, and on the other hand, it also protects the photosensitive components from damage. Since the front of the wafer is bonded to the transparent substrate, the optoelectronic devices cannot be wired from the front of the chip, and the package metal lines are connected to the metal pads of the chip to realize the photoelectric sensor. The chip signal is connected to the external package, but in actual production, due to defects in chip design or wafer manufacturing, some metal pads are too thin. After the package interconnection is completed, it breaks in the thermal shock resistance test, resulting Electrical failure, in order to solve the above technical problems, a photoelectric component package and its package structure are proposed

Method used

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  • Photoelectric element packaging body and packaging structure thereof
  • Photoelectric element packaging body and packaging structure thereof
  • Photoelectric element packaging body and packaging structure thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Embodiment 1: as Figure 1-5 As shown, the photoelectric element package and its packaging structure proposed by the present invention include a placement board 1, and slide rails 11 are fixedly installed on the top and bottom of the front side of the placement board 1. Move to a suitable position inside the slide rail 11, while the first movable block 10 inside the slide rail 11 will be stuck in the inside of the slide rail 11, and the limiting effect of the first movable block 10 will act on the fixed rod 9 effect, and then play a limiting effect on the photoelectric element placement plate 7, the inside of the slide rail 11 is equipped with a first movable block 10, the front of the first movable block 10 is welded with a fixed rod 9, and the front of the fixed rod 9 Both of them are fixedly equipped with energized clamping blocks 6, and the side of energized clamping blocks 6 close to each other is clamped with a photoelectric element placement plate 7, and tin wate...

Embodiment 2

[0023] Embodiment 2: as Figure 1-5 As shown, two electric wires 3 are welded on the side of the connecting block 8 away from each other, and the other end of the electric wire 3 is welded with the sidewall of the connecting block 8 located at the top and bottom of the electrified clamping block 6, and the electrified clamping block 6 is installed around the The connecting blocks 8 will be energized and magnetically exchanged through the electric wires 3. After the energized clamping block 6 obtains power from the connecting block 8, the photoelectric element placement plate 7 clamped between the energized clamping blocks 6 will be in an energized state. 3 is wrapped with a plastic protective sheet, the four corners of the bottom of the placement plate 1 are welded with fixed blocks 12, the two ends of the fixed block 12 are welded with the second movable block 13, and the inside of the second movable block 13 is provided with a buffer Tube 15, the bottom end of buffer tube 15...

Embodiment 3

[0024] Embodiment 3: as Figure 1-5 As shown, a chamber is provided on the top of the photoelectric element placement plate 7, and the bottom inner wall of the chamber is welded with a plurality of groups of welding feet 21 arranged in a rectangular array. The welding feet 21 penetrate and extend to the bottom of the chamber, and the extension plate 24 The top is fixed with a mounting plate 22 by bolts, and the top of the mounting plate 22 is fixed with a welded pipe 5 through a clamp. The welding program of the welded pipe 5 starts, and the welding head 25 will contact the contact pin of the welded leg 21 through the energization of the welded pipe 5. Then the welding head 25 will realize welding to the contact pin of the welding leg 21, so the photoelectric element and the welding leg 21 inside the photoelectric element placement plate 7 are welded as one. Two solder pipes 23 are sheathed on the top of the pipe 5, and a welding head 25 is fixedly installed on the left side o...

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Abstract

The invention discloses a photoelectric element packaging body and a packaging structure thereof, relates to the technical field of photoelectric element packaging, and aims to solve the problems of high cost, low stability and the like of photoelectric element packaging, and provides the following scheme: the photoelectric element packaging body comprises a placement plate, and sliding rails are fixedly mounted at the top and the bottom of the front surface of the placement plate; first movable blocks are arranged in the sliding rails in a sleeved mode, and fixing rods are welded to the front faces of the first movable blocks. The photoelectric element packaging device is ingenious in structure and reasonable in structural design, the photoelectric element is packaged in a tin water welding mode, the packaging effect on the photoelectric element is better, meanwhile, the packaging cost of the photoelectric element is effectively reduced, the clamping effect on the photoelectric element is achieved, the stable packaging effect is achieved, and in the design of the photoelectric element packaging device, the packaging stability is maintained, the packaging precision is further improved, and meanwhile, the method is high in practicability and wide in application range.

Description

technical field [0001] The invention relates to the technical field of photoelectric element packaging, in particular to a photoelectric element packaging body and its packaging structure. Background technique [0002] Photoelectric devices refer to devices made according to the photoelectric effect, called photoelectric devices, also known as photosensitive devices. There are many types of photoelectric devices, but their working principles are based on the physical basis of the photoelectric effect. The main types of photoelectric devices are: Phototubes, photomultiplier tubes, photoresistors, photodiodes, phototransistors, photocells, photocouplers, and packaging is the process of assembling integrated circuits into chip final products. Simply put, it is the process of bare integrated circuits produced by foundries. The chip is placed on a substrate that acts as a load bearing, the pins are drawn out, and then the package is fixed and packaged as a whole. The package emph...

Claims

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Application Information

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IPC IPC(8): H01L31/18H01L31/0203
CPCH01L31/18H01L31/0203Y02P70/50
Inventor 邹小梅
Owner 北京燕园智产科技有限公司