Array frame for producing high-power tubes and chip welding device

Abstract

The invention belongs to the technical field of chip welding, and particularly relates to an array frame for producing high-power tubes and a chip welding device. The chip welding device comprises a first rack and a conveying table, one side of the bottom end face of the first rack is a fixed end face, and the other side end face is provided with a sliding rail; a first electric rotating shaft is rotationally connected to the bottom, located on the fixed end face, of the first rack through a bearing, a welding plate is fixedly connected to the other end of the first electric rotating shaft, the welding plate is of a circular structure, and a plurality of first electric telescopic rods are arranged on the end face, different from the first electric rotating shaft, of the welding plate; and the end face of the fixed end of each first electric telescopic rod is fixedly connected with the welding plate. By arranging a sliding groove plate, an electric pulley on an operating rod slides in a sliding way, so that chips on a clamping plate can be quickly welded to welding grooves of main boards, and the chip processing efficiency is improved; and by arranging a fixing disc, the main boards in different shapes can be welded.

Description

technical field [0001] The invention belongs to the technical field of chip welding and relates to an array frame for producing high-power tubes and a chip welding device. Background technique [0002] Integrated circuit welding process, the welding process in integrated circuit manufacturing includes two aspects, one is circuit chip welding, and the other is inner lead welding. An integrated circuit is a circuit with a specific function that integrates a certain number of commonly used electronic components, such as resistors, capacitors, transistors, etc., and the connections between these components, through a semiconductor process. The circuit formed on a silicon substrate is an integrated circuit. Chips and integrated circuit chips need to use welding devices for welding processing during production. [0003] In the prior art, the soldering device has poor alignment between the soldering slots of the motherboard and the chips, and after the array frame is used to insta...

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Problems solved by technology

[0003] In the prior art, there is a situation in the welding device that the alignment between the welding groove of the motherboard and the chip is not high, and after the array frame is used to install the motherboard, it can only be soldered individually, resulting in low chip welding processing efficiency.

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