Wafer slide holder and wafer transmission device

Abstract

The invention provides a wafer carrying table and a wafer transmission device, and belongs to the technical field of chemical mechanical polishing equipment, and the wafer carrying table comprises a table body which is provided with a groove for accommodating a wafer; a buffer pad which is mounted at the bottom of the groove, wherein the wafer is placed on the buffer pad, at least one through hole is formed in the buffer pad, and the through hole is suitable for being connected with a clean water source or a clean air source through a pipeline. According to the wafer slide holder provided by the invention, the through hole is connected with a clean water source or a clean air source. In the wafer transfer process, the polishing head needs to adsorb and take away the wafer, and when the polishing head adsorbs the wafer, the clean water source or the clean air source is opened to wash or purge the space between the wafer and the buffer pad, so that the wafer is separated from the buffer pad, the water film effect between the wafer and the buffer pad is eliminated, the stable transmission of the wafer is ensured, errors of the wafer in the loading and unloading process due to hydroviscosity generated by the water film effect are avoided, and the wafer loading and unloading success rate is improved.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing equipment, in particular to a wafer loading platform and a wafer transmission device. Background technique [0002] The integrated circuit manufacturing process generally refers to depositing conductors, semiconductors, and insulating layers on a specific substrate (such as a silicon-based wafer) in a certain process sequence. In the manufacturing process, the Chemical Mechanical Planarization (CMP) technology is mainly used to globally planarize the microscopically rough surface of the wafer after the film deposition process, so as to carry out the subsequent semiconductor process. Using the synergistic effect of chemical etching and mechanical grinding, CMP can effectively take into account the local and global flatness of the wafer, and has been widely used in the manufacture of VLSI. [0003] In CMP technology, after chemical etching, the wafer needs to be mechanically g...

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Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect in the prior art that the water film effect is formed between the wafer and the non-metallic buffer pad due to the residual cleaning liquid, thereby affecting the wafer transfer process, thereby providing a wafer Round slide table and wafer transfer device

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