Integrated circuit chip manufacturing equipment capable of being automatically adjusted

Abstract

The invention discloses integrated circuit chip manufacturing equipment capable of being automatically adjusted. The integrated circuit chip manufacturing equipment comprises a base; a quick clamping mechanism fixedly mounted at the top of the base; an air pressure control mechanism arranged at the bottom of the inner cavity of the base; a PLC installed on the left side of the bottom end of the inner cavity of the base, wherein the quick clamping mechanism and the air pressure control mechanism are both electrically connected with the PLC; an operation panel arranged at the top end of the front side of the base and electrically connected with the PLC; and two sets of ventilation ports formed in the left end and the right end of the rear side of the base correspondingly. According to the integrated circuit chip manufacturing equipment capable of being automatically adjusted, a chip can be centered and clamped so as to improve the positioning precision in the chip machining process, opening, closing and clamping force can be controlled, a large amount of labor cost can be saved through the automatic adjusting scheme, time and labor are saved, and chip damage caused by too large clamping force can be avoided.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing, in particular to an automatically adjustable integrated circuit chip manufacturing equipment. Background technique [0002] The complete process of chip production includes chip design, chip production, packaging production, testing and other links. Among them, the chip production process is particularly complicated. The raw material wafer of the chip is composed of silicon, which is refined from quartz sand. , the wafer is the silicon element to be purified (99.999%), and then these pure silicon are made into silicon crystal rods, which become the material of quartz semiconductors for manufacturing integrated circuits. The thinner the circle, the lower the production cost, but the higher the process requirements, wafer lithography development, etching, this process is to coat a layer of photoresist on the surface of the wafer (or substrate) and dry it. Spray the developing solution o...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an automatically adjustable integrated circuit chip manufacturing equipment to at least solve the problems of uncentered clamping and difficult control of pre-tightening force in the prior art

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