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Intelligent system for dynamically measuring micro stress in solidification process of glue for bonding optical element and use method of intelligent system

A technology of optical components and dynamic measurement, which is applied in force/torque/power measuring instruments, measuring devices, measuring heat, etc., and can solve problems such as inaccurate and effective output of measured values ​​and difficulties in achieving measurement

Pending Publication Date: 2021-09-14
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Aiming at the problem that the traditional stress measurement method and measuring instrument are difficult to measure the micro stress during the bonding and solidification process of optical components caused by long bonding and solidification time of optical components and small stress values, and the problem that the measured values ​​cannot be accurately and effectively output for numerical analysis and processing , it is particularly important to invent a high-precision dynamic micro-force measurement system

Method used

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  • Intelligent system for dynamically measuring micro stress in solidification process of glue for bonding optical element and use method of intelligent system
  • Intelligent system for dynamically measuring micro stress in solidification process of glue for bonding optical element and use method of intelligent system
  • Intelligent system for dynamically measuring micro stress in solidification process of glue for bonding optical element and use method of intelligent system

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Experimental program
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Embodiment 1

[0071] see Figure 1 to Figure 6 , an intelligent system for dynamic measurement of micro-stress during the solidification process of glue for bonding optical components, including a mechanical sensing system 1, a data acquisition and signal processing system 2, and a result analysis and display system 3;

[0072] The mechanical sensing system 1 collects the physical signal of viscose solidification in the vertical direction force and the temperature physical signal of the measurement environment in real time, and transmits it to the data acquisition and signal processing system 2;

[0073] The mechanical sensing system 1 includes an installation base 1-1, a viscose filling workbench 1-2, a dynamic force transmission structure 1-3, a temperature sensor 1-4, a high rigidity support structure I1-5, and a high rigidity support structure II1- 6. Force sensor 1-7;

[0074] A dynamic force transmission structure 1-3 is installed on the installation base 1-1;

[0075] The viscose f...

Embodiment 2

[0115] An intelligent system for dynamic measurement of micro-stress in the solidification process of glue used for bonding optical components, including:

[0116] Mechanical sensing system 1, including high-precision force sensor 1-7, dynamic force transmission structure 1-3, high rigidity support structure 1-5 and 1-6, viscose filling workbench 1-2 and installation base 1-1, Among them, the dynamic force transmission structure 1-3 includes the power column 1-3-1 connecting the large screw 1-3-2, connecting the small screw 1-3-3 and the sensor contact seat 1-3-4, viscose filling workbench 1 -2 includes the upper bonding block 1-2-2, the lower bonding block 1-2-3 and the micro-distance adjustment structure (except all 1-2 structures of 1-2-2 and 1-2-3), The filling thickness of the viscose is controlled by the micro-pitch adjustment structure, and the dynamic stress value during the solidification of the viscose is transmitted to the data acquisition and signal processing syst...

Embodiment 3

[0125] The method for using the intelligent system for micro-stress dynamic measurement during the solidification process of the glue used for bonding optical components includes the following steps:

[0126] 1) Build an intelligent system for dynamic measurement of micro-stress during the solidification process of glue used for bonding optical components;

[0127] After building an intelligent system for dynamic measurement of micro-stress in the solidification process of glue used for bonding optical components, the intelligent system was calibrated.

[0128] 2) Configure the liquid gel to be tested;

[0129] 3) Start the intelligent system, fill the liquid gel to be tested with a thickness d in the gel filling tank; during the filling process, the temperature sensors 1-4 monitor the ambient temperature, and send the results to the analysis and display system 3;

[0130] 4) Adjust the micro-distance adjustment structure quick adjustment handle 1-2-5 until the distance betwe...

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Abstract

The invention discloses an intelligent system for dynamically measuring micro stress in a solidification process of glue for bonding an optical element and a use method of the intelligent system. The system comprises a mechanical sensing system, a data acquisition and signal processing system and a result analysis and display system. The method comprises the following steps of 1) starting the intelligent system, and filling a solidification glue filling groove with to-be-detected liquid solidification glue with the thickness of d, 2) adjusting the micro-distance adjusting structure fast adjusting handle until the distance between the upper liquid level of the to-be-measured liquid solidification glue in the solidification glue filling groove and the upper bonding block is less than l, (3) adjusting a micro-distance adjusting structure slow adjusting handle to enable the to-be-detected liquid solidification glue in the solidification glue filling groove to be tightly attached to the lower bottom surface of the upper bonding block, and 4) enabling the result analysis and display system 3 to calculate the average instantaneous stress in the time period t according to the dynamic force physical signal. The change trend of the dynamic micro stress and the environment temperature can be obviously displayed, and the difficulty of stress measurement data output and analysis processing is overcome.

Description

technical field [0001] The invention relates to the technical field of dynamic micro-stress measurement, in particular to an intelligent system for dynamic micro-stress measurement during the solidification process of glue used for bonding optical elements and a method for using the same. Background technique [0002] Compared with the mechanical connection method, the adhesive bonding method has the advantages of light weight, low cost, small stress, and low assembly difficulty. In recent years, in the field of space remote sensing, the use of adhesive bonding technology to install optical components has become more and more popular for optical machine products. For high-precision optical components, even under the slight stress of the adhesive during the assembly process, surface shape changes will occur, which will affect the optical imaging quality of the lens. At present, there is no literature on the research on the assembly of high-precision optical components induce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L5/00G01K13/00
CPCG01L5/00G01K13/00
Inventor 郑祥柯李华康世发王鹏舒林森陈彦龙赵亮王家胜
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI