Electronic component packaging structure of IML touch film and manufacturing method of electronic component packaging structure

Abstract

The invention discloses an electronic component packaging structure of an IML touch film and a manufacturing method of the electronic component packaging structure. The packaging structure comprises an IML touch film main body, a conductive circuit layer, an electronic component and a conductive glue body; the conductive circuit layer is arranged on the IML touch film main body; a pin of the electronic component is connected with the conductive circuit layer through the conductive glue body. According to the electronic component packaging structure of the IML touch film, the electric connection between the electronic component and the conductive circuit layer is realized by using the conductive glue body, so that the connection reliability between the electronic component and the conductive circuit layer is improved; cracking and separation of the connection position of the electronic component and the conductive circuit layer in the subsequent working procedures such as stretching forming are avoided as much as possible, and the yield of the IML touch film is increased; in addition, the electronic component can be connected to the conductive circuit layer at a low temperature, the IML touch film is prevented from being scalded due to too high temperature in the installation process of the electronic component; and the arrangement of a decorative layer wave thin film is omitted, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of IML touch film, in particular to an electronic component packaging structure of an IML touch film and a manufacturing method thereof. Background technique [0002] The existing IML touch film is relatively popular in the in-mold injection molding industry due to its many advantages such as good touch sensitivity, free design, simple assembly, light weight, and high-tech sense. [0003] The current IML touch film technology usually uses SMT technology to mount electronic components on the conductive ink layer. Specifically, the electronic components are soldered to the IML touch film through solder paste. However, tin After the paste is cured, it is relatively fragile. In the subsequent processes such as stretching and molding, the solder paste welding position is prone to cracking, resulting in poor contact or even open circuit; [0004] Secondly, in the actual soldering process, since the curing tempera...

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Problems solved by technology

[0003] The current IML touch film technology usually uses SMT technology to mount electronic components on the conductive ink layer. Specifically, the electronic components are soldered to the IML touch film through solder paste. However, tin After the paste is cured, it is relatively fragile. In the subsequent processes such as stretching and molding, the solder paste welding position is prone to cracking, resulting in poor contact or even open circ

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