Equal cutting device for producing and processing copper-clad laminate

A copper-clad laminate and cutting device technology, applied in metal processing, metal processing equipment, manufacturing tools, etc., can solve problems such as burrs, difficulties, and affecting the normal use of copper-clad laminates

Active Publication Date: 2021-09-17
江苏振宁半导体研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when cutting double-layer copper clad laminates, both sides of the copper clad laminates are covered with copper foil. Due to the rapid rotation of the cutter in one direction of the traditional cutting equipment, it is easy to cause the cutting position on the bottom side of the copper clad laminate to be damaged due to the tearing of the cutter. The phenomenon of foil detachment, which leads to burrs and even affects the normal use of copper clad laminates. At the same time, when cutting copper clad laminates of different thicknesses and sizes, it is inconvenient to fix the copper clad laminates, which makes the copper clad laminates prone to sliding displacement during the cutting process. The situation affects the cutting accuracy, and in order to complete the cutting of the copper clad laminate, for the subsequent etching effect, the copper clad laminate needs to be polished, and the operation of grinding the copper clad laminate with a large area is more difficult

Method used

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  • Equal cutting device for producing and processing copper-clad laminate
  • Equal cutting device for producing and processing copper-clad laminate
  • Equal cutting device for producing and processing copper-clad laminate

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Embodiment Construction

[0028] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0029] Such as Figure 1-Figure 10 As shown, a cutting device for production and processing of copper-clad laminates according to the present invention includes a support base 1, the side of the support base 1 is provided with a cutting structure 2; pressing structure 3; the side of the cutting structure 2 is provided with a conveying structure 4; the bottom side of the cutting structure 2 is provided with a grinding structure 7; the inside of the cutting structure 2 is provided with a limiting structure 5; A pushing structure 6 is provided on the top side.

[0030] Specifically, the cutting structure 2 includes an operation panel 21, the side of the support base 1 is fixedly connected with the operation panel 21, the top side of the support base...

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Abstract

The invention relates to the technical field of copper-clad laminate processing, in particular to an equal cutting device for producing and processing a copper-clad laminate. The device comprises a supporting seat, and a cutting structure is arranged on the side surface of the supporting seat; an extrusion structure is mounted on the side surface of the supporting seat; a conveying structure is arranged on the side face of the cutting structure; a polishing structure is arranged on the bottom side of the cutting structure; a limiting structure is arranged on the inner side of the cutting structure; and a pushing structure is arranged on the top side of the cutting structure. The situation that copper foil on the bottom side of a copper-clad plate is turned up in the cutting process is avoided through the cutting structure, the stability of the copper-clad plate in the cutting process is guaranteed through the extrusion structure, the copper-clad plate moves more stably during cutting through the conveying structure, the polishing structure is used for quickly polishing the cut copper-clad plate, the limiting structure is used for ensuring the accuracy of the cutting specification of the copper-clad plate, and the pushing structure is used for pushing the copper-clad plates of different specifications, so that the limiting effect on the copper-clad plate is ensured.

Description

technical field [0001] The invention relates to the technical field of processing copper-clad laminates, in particular to an equal-section cutting device for production and processing of copper-clad laminates. Background technique [0002] Copper Clad Laminate (CCL) is a plate material made by impregnating electronic glass fiber cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing, referred to as CCL. Various printed circuit boards of different forms and functions are selectively processed, etched, drilled and copper-plated on the copper clad laminate to make different printed circuits. It mainly plays the role of interconnection, insulation and support for printed circuit boards, and has a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Printed circuit boards are an important part of today's electronic products, and copper clad laminates are a major subs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B26D11/00B26D1/03B26D1/15B26D7/01B26D7/02B26D7/06B26D7/27B24B7/10
CPCB26D11/00B26D1/035B26D1/15B26D7/01B26D7/025B26D7/06B26D7/27B24B7/10B26D2011/005Y02P70/10
Inventor 徐龙廷
Owner 江苏振宁半导体研究院有限公司
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