Silicon carbide power device packaging shell capable of being uncapped

Abstract

The invention discloses a silicon carbide power device packaging shell capable of being uncapped. The silicon carbide power device packaging shell comprises a lower substrate, a positive electrode, a positive lead, a negative electrode and an upper substrate. A silicon carbide chip is arranged on the surface of the lower substrate; the positive electrode is of a latticed structure, is arranged on the surface of the silicon carbide chip and is electrically connected with the positive lead and the silicon carbide chip; the negative electrode is arranged on the lower substrate and is electrically connected with the silicon carbide chip; and the upper substrate covers the positive electrode, the upper side of the upper substrate is hinged to the upper side of the lower substrate, and the lower side of the upper substrate is detachably and fixedly connected with the lower side of the lower substrate. According to the invention, the lower substrate and the upper substrate are hinged at the upper side and are detachably connected at the lower side, when a single particle radiation experiment is carried out, after the lower side of the upper substrate and the lower side of the lower substrate are detached, the upper substrate is turned up to form an open cap, so that the structure of the packaging shell does not need to be damaged, and the operation is very convenient.

Description

technical field [0001] The invention belongs to the technical field of microelectronic equipment, and in particular relates to a cap-openable silicon carbide power device packaging shell. Background technique [0002] When testing the radiation resistance performance of silicon carbide devices, it is often necessary to conduct radiation experiments on silicon carbide devices. In single event radiation experiments, it is necessary to use high-energy particle beams to directly bombard the surface of the device. For packaged silicon carbide devices, additional capping treatment is required, which is inconvenient to operate. Moreover, in the process of uncapping, there is a high possibility that the surface of the chip will be damaged, causing artificial damage. In addition, after the radiation experiment is over, the device needs to be repackaged, which is complicated to operate, and the chip is exposed to the air for a long time, which is likely to cause performance degradati...

AI Technical Summary

Problems solved by technology

In single event radiation experiments, high-energy particle beams need to be used to directly bombard the surface of the device, and additional capping treatment is required for packaged silicon carbide devices, which is inconvenient to operate

Moreover, in the process of uncapping, it is very likely to damage the surface of the chip, causing artificial damage

In addition, after the radiation experiment is over, the device needs to be repackaged, the operation is complicated, and the chip is exposed to the air for a long time, which is easy to cause performance degradation

Therefore, when performing radiation experiments on devices, it is very inconvenient to use

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