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SMT steel mesh tension on-line test method and equipment

An online testing and steel mesh technology, applied in tension measurement, printed circuits, electrical components, etc., can solve the problems of low detection efficiency and inability to eliminate human operation errors, and achieve the effect of improving detection efficiency and eliminating human operation errors.

Active Publication Date: 2021-09-17
NEW H3C TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has low detection efficiency and cannot eliminate human error

Method used

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  • SMT steel mesh tension on-line test method and equipment
  • SMT steel mesh tension on-line test method and equipment
  • SMT steel mesh tension on-line test method and equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0062] Embodiment two, increase on the basis of embodiment one, such as figure 2 :

[0063] 115: If not, the buzzer linked with the solder paste proportion tester can be used to alarm to remind the operator that the stencil is unqualified, so as to facilitate timely replacement;

[0064] Since the tension N' detected by the test point is not necessarily an integer, such as 41.95N / cm. This test value is generally related to the instrument measurement accuracy of the tension tester 4, and can be rounded up within the set error range to obtain the tension N' of the point to be measured as 42N / cm.

Embodiment 3

[0065] Embodiment three, increase on the basis of above-mentioned embodiment two, such as image 3 :

[0066] 117: If the tension test frequency is selected as the tension test before each stencil printing, after the solder paste printing, in the process of attaching the PCB board, perform the next round of the above tension online test on the stencil. In this way, there is no need to stop the line during testing, which can greatly save testing time.

[0067] Before performing solder paste printing in step 111 of the above embodiment, the PCB board 2 and the stencil need to be positioned and installed. The installation is realized by positioning the marked points 11 of the stencil and the marked points 21 of the PCB. As a preferred embodiment for realizing positioning, a CCD camera 3 is installed on the printing machine for installing the stencil, and the software of the CCD camera 3 is used to calibrate the stencil marking point 11 and the PCB board marking point 21 for pos...

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Abstract

The invention provides an SMT steel mesh tension online test method and device, and the method comprises the steps: obtaining the theoretical tension data N of a steel mesh, the total solder paste demand corresponding to the steel mesh, and a corresponding correction coefficient a; according to the theoretical tension data of the steel mesh and the corresponding correction coefficient a, the theoretical tension N'<theory> = N<theory> + a of the steel mesh under the condition that the solder paste with the total demand quantity is coated is obtained; coating solder paste in total demand on the steel mesh, selecting a point to be tested on the steel mesh and setting tension test frequency; testing the tension N' of the to-be-tested point, judging whether the tension N' of the to-be-tested point is greater than or equal to N', and if yes, conducting solder paste printing on the PCB through the steel mesh. Online steel mesh tension testing is achieved, the detection efficiency is improved, and manual operation errors can be eliminated.

Description

technical field [0001] The present application relates to the technical field of communication equipment, in particular to an SMT stencil tension online testing method and equipment. Background technique [0002] SMT (Surface Mounted Technology, Chinese name is Surface Mount Technology) is currently the most commonly used technology in the electronic assembly industry. PCB boards (Printed Circuit Board, printed circuit boards) do not need to drill holes, and can be directly mounted on the surface. Mount the device and solder it to the specified position on the surface of the PCB. Components processed by SMT technology have high assembly density, small size and light weight. [0003] The solder paste and stencil used in SMT production are called auxiliary materials, but they play a vital role in printing quality. The solder paste is printed on the solder pad (PCB pad) of the substrate through the opening of the stencil to release the solder paste, which is called solder pas...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K13/08G01L5/04
CPCH05K3/303H05K13/08G01L5/04Y02P70/50
Inventor 陈康刘凯张羽
Owner NEW H3C TECH CO LTD