Method of forming semiconductor device
A semiconductor and conductive technology, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc.
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[0077] The following provides a number of different embodiments or examples for implementing different components of an embodiment of the disclosure. Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these are just examples and are not intended to limit the embodiments of the present disclosure. For example, the dimensions of the elements are not limited to the disclosed ranges or values, but may depend on process conditions and / or desired characteristics of the device. In addition, in the following description, it is mentioned that the first part is formed on or on the second part, which may include an embodiment in which the first part and the second part are formed in direct contact, and may also include an embodiment where the first part and the second part are formed. An embodiment in which an additional part is formed between the second part so that the first part and the second part may ...
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