Novel process for electroforming jewelry by using platinum

A platinum and electroforming technology, applied in the field of new platinum electroforming jewelry technology, can solve problems such as brittle cracking

Inactive Publication Date: 2021-09-24
深圳市永达锐国际科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a novel platinum electroforming jewelry process to solve the existing problems: the existing electroforming process can only electroplate platinum coatings below 100 μm, and electroplating platinum coatings above 100 μm is prone to hydrogen embrittlement. Brittle crack

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  • Novel process for electroforming jewelry by using platinum
  • Novel process for electroforming jewelry by using platinum

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Embodiment Construction

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038] The present invention is a kind of novel platinum electroforming jewelry technology, comprises the following steps:

[0039] S1: Bottom mold processing;

[0040] Described base mold processing comprises the following steps:

[0041] S101: alloy billet forming, injection molding tin indium into alloy billet;

[0042] Here, the weight ratio of the tin-indium is 9:1, and the melting point of the alloy billet is 90°C-110°C;

[0...

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Abstract

The invention discloses a novel process for electroforming jewelry by using platinum, and relates to the technical field of jewelry machining. The process comprises the following steps that a bottom die is machined; platinum electroforming is conducted, specifically, tetraammine platinum sulfate is used as main salt, potassium sodium tartrate tetrahydrate is used as conducting salt, an electroforming solution is formed, the surface of the bottom die is electroplated with a platinum plating layer of 100 microns-500 microns in the electroforming solution, and a rough workpiece is formed; and platinum hollow die forming is conducted, specifically, the bottom die of a rough workpiece is removed, the rough workpiece is ground and polished, and the jewelry is formed. According to the process, the platinum plating layer with the thickness of 100 microns-500 microns can be electroformed through cooperation of all the steps, the probability of the hydrogen embrittlement phenomenon of the electroformed platinum plating layer is low, and the problem that the platinum plating layer is prone to brittle cracking due to the hydrogen embrittlement phenomenon when the platinum plating layer with the thickness of 100 microns or above is electroplated is solved.

Description

technical field [0001] The invention belongs to the technical field of jewelry processing, in particular to a novel platinum electroforming jewelry technology. Background technique [0002] Jewelry refers to the raw materials and semi-finished products of jewelry, jade and precious metals, as well as jewelry, craft decorations and art collections made of raw materials and semi-finished products of jewelry, jade and precious metals; [0003] In the prior art, in order to improve the aesthetics of jewelry, platinum is often electroplated on the surface of jewelry, but the existing electroforming process can only electroplate platinum coatings below 100 μm, and platinum coatings above 100 μm are prone to brittle cracks due to hydrogen embrittlement. open. Contents of the invention [0004] The purpose of the present invention is to provide a novel platinum electroforming jewelry process to solve the existing problems: the existing electroforming process can only electroplate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D1/10C25D1/00
CPCC25D7/005C25D1/10C25D1/00
Inventor 邓达贤蔡维真
Owner 深圳市永达锐国际科技有限公司
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