Novel process for electroforming jewelry by using platinum
A platinum and electroforming technology, applied in the field of new platinum electroforming jewelry technology, can solve problems such as brittle cracking
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[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0038] The present invention is a kind of novel platinum electroforming jewelry technology, comprises the following steps:
[0039] S1: Bottom mold processing;
[0040] Described base mold processing comprises the following steps:
[0041] S101: alloy billet forming, injection molding tin indium into alloy billet;
[0042] Here, the weight ratio of the tin-indium is 9:1, and the melting point of the alloy billet is 90°C-110°C;
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