Test jig for the binding force of metal layer after chip manufacturing evaporation process
A test fixture and bonding force technology, used in semiconductor/solid-state device testing/measurement, measurement devices, and mechanical devices, etc., can solve problems such as wafer scrap detection accuracy, ensure accuracy, avoid waste, and improve detection. The effect of precision
Active Publication Date: 2021-09-28
江苏晟驰微电子有限公司
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Problems solved by technology
[0006] For this reason, the present invention provides a test fixture for the bonding force of the metal layer after the chip manufacturing evaporation process, to overcome the direct scrapping of the wafer and the low detection accuracy caused by the insufficient metal bonding force after the wafer is cut in the prior art The problem
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[0057] In order to make the objects and advantages of the present invention clearer, the present invention will be further described below in conjunction with the examples; it should be understood that the specific examples described here are only for explaining the present invention, and are not intended to limit the present invention.
[0058] Preferred embodiments of the present invention are described below with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are only used to explain the technical principle of the present invention, and are not intended to limit the protection scope of the present invention.
[0059] It should be noted that, in the description of the present invention, terms such as "upper", "lower", "left", "right", "inner", "outer" and other indicated directions or positional relationships are based on the terms shown in the accompanying drawings. The direction or positional relationship shown is ...
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The invention relates to a test jig for the binding force of a metal layer after a chip manufacturing evaporation process, and the test jig comprises a blue film pasting mechanism which is used for pasting a blue film and comprises a blue film fixing part; a wafer fixing mechanism which is used for fixing a wafer and comprises a wafer fixing disc; a blue film extrusion mechanism which is used for extruding the blue film and comprises a sliding part and an extrusion part, wherein the extruding part is fixedly connected to the sliding part; a mechanical arm which is used for tearing down the pasted blue film; and a central control unit which is connected with the blue film pasting mechanism, the wafer fixing mechanism, the blue film extruding mechanism and the mechanical arm and used for controlling the device to operate. According to the invention, the accuracy of the metal binding force test can be ensured, and the detection precision is improved; meanwhile, by using the test jig provided by the invention, a wafer does not need to be cut, and the wafer with insufficient metal bonding force can be timely found and reworked, so the waste of the wafer is avoided.
Description
technical field [0001] The invention relates to the technical field of chip detection, in particular to a test fixture for the bonding force of a metal layer after a chip manufacturing evaporation process. Background technique [0002] Current discrete device chips generally use multi-layer metal as chip electrodes. [0003] The metal layer process on the market generally adopts electron beam evaporation method, sputtering method, electrochemical plating method and CVD method. Electron beam evaporation method; sputtering method; electrochemical plating method; CVD method is generally used for the deposition of metal tungsten for integrated circuits. [0004] In order to take into account the cost and relevant environmental protection regulations, the protection device chip mostly adopts the electron beam evaporation process. Compared with the sputtering process, the energy of the gas phase metal reaching the wafer surface is relatively small, and the adhesion of the metal ...
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IPC IPC(8): G01N19/04H01L21/66
CPCG01N19/04H01L22/12H01L22/20
Inventor 崔文荣
Owner 江苏晟驰微电子有限公司