Bonding machine heating and cooling device
A technology of cooling device and bonding machine, applied in the field of bonding machine, can solve the problems of long cooling time, difficult heating and cooling device, scalded wafer when taking out, and achieves the effect of high safety, improved cooling effect, and accelerated cooling speed
Active Publication Date: 2021-11-02
烟台一诺电子材料有限公司
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- Application Information
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Problems solved by technology
[0004] (1) After the wafer bonding is completed, the wafer needs to be taken out, but the heating and cooling device is difficult to cool down quickly, resulting in a certain risk of burns when taking out the wafer
[0005] (2) When the heating and cooling device is self-cooling, it generally uses its internal cooling structure for cooling to achieve gradual cooling from the inside to the outside, and the cooling time is longer
Method used
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Embodiment 2
[0048] Based on the bonding machine heating and cooling device provided in the first embodiment of the present application, the second embodiment of the present application proposes another bonding machine heating and cooling device. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.
[0049] Attached below Figure 7-Figure 9 and Embodiment The second embodiment of the present invention will be further described.
[0050] The upper side of the push block 5 is provided with a heat dissipation plate 1 31, and the lower end of the push block 5 is fixedly connected with a heat dissipation plate 2 42, and the heat dissipation plate 2 42 can be fixed on the lower end of the push block 5 in the form of point contact, so as to ensure acceptance of air cooling, A compression spring 37 and a telescopic tube 38 are fixedly connected between the rad...
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The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device, which includes a top seat and a base set up and down, and a second heating and cooling seat matching the first heating and cooling seat is fixedly connected to the side end of the base. Heating and cooling seat, a conveying mechanism is arranged between the first heating and cooling seat and the second heating and cooling seat, the first heating and cooling seat is connected with a transmission mechanism, and the transmission mechanism includes a first rack and a gear set, the The conveying mechanism includes a push block and a second rack. The first rack drives the second rack through a gear set to reciprocate between the base and the second heating and cooling seat with the push block. The present invention uses the first rack, With the cooperation of the gear set, the second rack and the push block, after the wafer bonding is completed, as the first heating and cooling seat moves upward, the push block will push the bonded wafer out of the second heating and cooling seat to realize The automatic removal of the wafer greatly reduces the risk factor of burns during the removal process of the wafer, and the safety is higher.
Description
technical field [0001] The invention relates to the technical field of bonding machines, in particular to a bonding machine heating and cooling device. Background technique [0002] A bonding machine is an instrument used in the field of physics. Wafer bonding technology can bond wafers of different materials together. Wafer bonding is an important process for three-dimensional processing of semiconductor devices. The main process steps of wafer bonding include wafer surface treatment, wafer alignment and final wafer bonding. Through these process steps, individual single wafers are aligned and then bonded together to achieve their three-dimensional structure. The bonding machine needs to put the materials to be bonded between two heated plates, and then apply external conditions such as pressure, temperature, and voltage to bond the materials together through van der Waals force, molecular force, or even atomic force. Therefore, pressure and temperature are two important ...
Claims
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IPC IPC(8): H01L21/67B23P11/02
CPCH01L21/67109H01L21/67092B23P11/025
Inventor 林良高琪王岩王婷杜金源
Owner 烟台一诺电子材料有限公司