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Diamond collator and grinding machine table with same

An organizer and diamond technology, applied in the direction of manufacturing tools, grinding machine parts, grinding/polishing equipment, etc., can solve the problems of affecting the cleaning effect of the grinding pad, reducing the grinding efficiency, etc., to achieve convenient movement, prolong service life, Guaranteed cleaning effect

Pending Publication Date: 2021-10-08
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved in the present invention is to overcome the defect that the diamond finisher in the prior art will reduce the grinding efficiency and affect the cleaning effect of the grinding pad with the prolongation of the service time, thereby providing a kind of grinding efficiency that is high and effective for grinding. Diamond finisher with good cleaning effect of pad and grinder table having same

Method used

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  • Diamond collator and grinding machine table with same
  • Diamond collator and grinding machine table with same
  • Diamond collator and grinding machine table with same

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specific Embodiment approach

[0031] To this end, this application proposes as figure 1 and 2 A specific implementation of the diamond organizer shown includes a body 1, a support structure provided on the body 1, and a plurality of diamonds 2 fixed on the support structure.

[0032] The support structure is rollingly connected with the body 1 , and when the body moves, the support structure rolls back and forth relative to the body 1 . The support structure has an arc-shaped bearing surface, and the arc-shaped bearing surface is provided with a plurality of accommodation cavities 5. The accommodation chambers 5 are formed by inward depressions on the arc-shaped bearing surface, and the shape is consistent with that of the diamond 2, and its size is slightly smaller than that of the diamond 2. size. Specifically, the support structure is a cylinder, including a bearing 3 and a roller 4 disposed in the bearing 3, the bearing 3 is fixed on the body 1, and the two ends of the roller 4 are respectively insta...

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Abstract

The invention relates to the technical field of semiconductor grinding tools, in particular to a diamond collator and a grinding machine table with the same. The diamond collator comprises a body, a supporting structure and a plurality of diamonds; the supporting structure is arranged on the body and connected with the body in a rolling mode, the supporting structure is provided with an arc-shaped bearing face, and a plurality of containing cavities are formed in the arc-shaped bearing face; and the plurality of diamonds are correspondingly fixed in the corresponding containing cavities, and parts of the diamonds are exposed outside. The invention provides the diamond collator which is high in grinding efficiency and good in grinding pad cleaning effect and the grinding machine table with the same.

Description

technical field [0001] The invention relates to the technical field of semiconductor grinding tools, in particular to a diamond finisher and a grinding machine table with the same. Background technique [0002] Chemical mechanical planarization (CMP) is a technology commonly used in semiconductor manufacturing processes. Chemical mechanical planarization uses mechanical force combined with chemical etching to planarize the surface of wafers or other semiconductor components during processing. In the chemical mechanical planarization process of semiconductors, the common technology is to use the polishing pad to contact the surface of the wafer or other semiconductor components, so as to grind the wafer or other semiconductor components by mechanical force, and match them together at the same time Chemical etching is used to remove impurities or uneven structures on the surface of wafers or other semiconductor components through chemical reactions and physical and mechanical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/017
CPCB24B53/017
Inventor 田国军崔凯
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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