Preparation method of high-breakdown and high-dielectric FPE-based composite material film

A composite material film and high dielectric technology, which is applied in the field of preparation of FPE-based composite material film, can solve the problems of increased conductivity and dielectric loss of composite film, and achieve the improvement of dielectric properties, excellent dielectric properties, and preparation process simple effect

Active Publication Date: 2021-10-08
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the polymer is doped with fillers, the dielectric loss and electrical conductivity of the composite film will also increase significantly.

Method used

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  • Preparation method of high-breakdown and high-dielectric FPE-based composite material film
  • Preparation method of high-breakdown and high-dielectric FPE-based composite material film
  • Preparation method of high-breakdown and high-dielectric FPE-based composite material film

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specific Embodiment approach 1

[0018] Specific embodiment one: the preparation method of a kind of high breakdown and high dielectric FPE-based composite film of this embodiment is carried out according to the following steps:

[0019] adding the hexagonal boron nitride nanosheets into the methylpyrrolidone solution, and ultrasonically dispersing for 40 to 120 minutes to obtain a mixed solution a, wherein the mass fraction of the hexagonal boron nitride nanosheets in the mixed solution a is 5% to 20%; SiO was added to solution a 2 Particles are ultrasonically dispersed for 40 to 120 minutes to obtain a mixed solution b in which SiO 2 The mass fraction of the particles is 3% to 9%; while stirring, the fluorene polyester particles are added to the mixed solution b, and stirred for 1 to 2 hours to obtain the stirred mixed solution b. The volume of the methylpyrrolidone solution is the same as The mass ratio of fluorene polyester particles is (3.5~4)mL:(0.4~0.6)g; evenly coat the stirred mixed solution b on on...

specific Embodiment approach 2

[0023] Embodiment 2: This embodiment differs from Embodiment 1 in that: the mass fraction of hexagonal boron nitride nanosheets in the mixed solution a is 5%, 10%, 15% or 20%.

[0024] Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0025] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: SiO in the mixed solution b 2 The mass fraction of particles is 3%, 5%, 7% or 9%.

[0026] Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a preparation method of a high-breakdown and high-dielectric FPE-based composite material film, and relates to the technical field of FPE-based composite material films. The invention aims to solve the problems that the dielectric constant of a traditional composite material film taking FPE as a matrix is low, the dielectric loss and the conductivity of the composite film doped with filler are obviously increased, and the breakdown field strength is reduced. The method comprises the following steps: adding hexagonal boron nitride nanosheets into a methyl pyrrolidone solution, and carrying out ultrasonic dispersion to obtain a mixed solution a; adding SiO2 particles into the mixed solution a, and performing ultrasonic dispersion to obtain a mixed solution b; adding fluorene polyester particles into the mixed solution b, and conducting stirring for 1-2 hours to obtain a stirred mixed solution b; and uniformly coating one surface of a pretreated substrate with the stirred mixed solution b, heating the substrate, carrying out heat preservation, finally cooling the substrate to room temperature, and stripping the film on the substrate to obtain the high-breakdown and high-dielectric FPE-based composite material film.

Description

technical field [0001] The invention relates to the technical field of FPE-based composite material films, in particular to a preparation method of a high-breakdown and high-dielectric FPE-based composite material film. Background technique [0002] In recent years, the electrical, electronic and communication industries have developed rapidly, and people have higher and higher requirements for product performance. Polymer dielectric materials have good application prospects in the industry due to their good mechanical, thermal and electrical properties. At the same time, the researchers found that the polymer has excellent performance in many properties, but its application is limited due to its low dielectric constant. Therefore, it has become a technical problem to be solved by relevant researchers to improve the dielectric constant, dielectric loss and breakdown performance of polymer dielectrics by doping fillers with certain characteristics in polymers. However, when...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L67/00C08K7/00C08K3/38C08K3/36
CPCC08J5/18C08J2367/00C08K7/00C08K2003/385C08K3/36C08K2201/011
Inventor 张文超赵阔冯宇殷景华
Owner HARBIN UNIV OF SCI & TECH
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