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Semiconductor memory device and method of repairing in the semiconductor memory device

A memory device and memory controller technology, applied in static memory, instruments, electrical digital data processing, etc., can solve the problems of increased area of ​​the repaired part of the memory controller, increased number of faulty addresses, and increased area.

Inactive Publication Date: 2021-10-12
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of a general memory employed in a dual in-line memory module (DIMM), such as a general dynamic random access memory (DRAM) having a relatively large memory size and a relatively large number of spare cells, failure The number of addresses may increase
This may lead to an increase in the area occupied by the CAM that stores the fault address
Correspondingly, the area of ​​the repair part of the memory controller may also increase

Method used

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  • Semiconductor memory device and method of repairing in the semiconductor memory device
  • Semiconductor memory device and method of repairing in the semiconductor memory device
  • Semiconductor memory device and method of repairing in the semiconductor memory device

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Embodiment Construction

[0024] In the following description of the embodiments, it will be understood that the terms "first" and "second" are intended to identify elements, but are not used to limit a specific number or order of the elements. In addition, when an element is referred to as being located "on", "over", "above", "under" or "beneath" another element, it means a relative positional relationship and is not intended to limit the direct relationship between one element and the other element. Something that touches another element or that there is at least one intervening element therebetween. Accordingly, terms such as "on", "above", "above", "below", "below", "beneath" as used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of this disclosure. Also, when an element is referred to as being "connected" or "coupled" to another element, the element may be directly connected or coupled to the other element, electrically or mechanically...

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Abstract

The invention provides a semiconductor memory device and a method of repairing in the semiconductor memory device. The semiconductor memory device includes a memory and a memory controller configured to control the memory. The memory controller includes a normal operation control part and a repair part. The normal operation control part is configured to control a normal operation of the memory and includes a plurality of storage spaces used while the normal operation is controlled. The repair part is configured to control a repair operation of the memory and stores faulty addresses detected while the repair operation is controlled into the plurality of storage spaces included in the normal operation control part.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2020-0033926 filed on March 19, 2020, the entire contents of which are hereby incorporated by reference. technical field [0003] Various embodiments of the present disclosure relate to semiconductor memory systems, and more particularly, to semiconductor memory devices including repair logic circuits and repair methods of semiconductor memory systems. Background technique [0004] With the development of semiconductor technology, high-performance memory devices having large storage capacities have been produced. Recently, in the mass production of memory devices, in order to improve the manufacturing yield and the quality of memory devices, it is inevitable to use spare cells (also called redundant cells) to replace faulty cells (also called failed cells). Various restoration techniques. Embedded memory devices used in most systems-on-chip (SOC) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C29/44
CPCG11C29/44G11C2029/3602G11C2029/4402G11C2029/1208G11C29/4401G11C29/816G11C29/76G11C29/814G11C29/81G11C29/808G11C29/12G06F2201/85G11C29/38G06F11/2094G11C29/16G11C29/70
Inventor 林在日禹洙海
Owner SK HYNIX INC