Integrated circuit board welding foot cutting device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TIANJIN UNIV
- Publication Date
- 2021-10-22
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Abstract
Description
technical field
[0001] The invention relates to the technical field of circuit board welding leg cutting. Specifically, the utility model relates to a cutting device for solder feet of an integrated circuit board. Background technique
[0002] With the continuous development of the electronic information manufacturing industry, the demand for circuit boards is gradually increasing. After the circuit board is manufactured, different components need to be welded on the circuit board. In the prior art, the cutting of the welding feet of the circuit board is often carried out directly by using a high-speed rotating cutter head. When cutting, the welding feet will be applied with a thrust parallel to the movement of the circuit board or the direction of the cutter head. And the tangential force in the rotation direction of the cutter head, when the cutting feed rate is too large or the sharpness of the cutter head decreases, it will cause the solder leg to bend. After the solder...