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Method for measuring internal temperature of integrated circuit

An internal temperature and integrated circuit technology, applied in thermometers, measuring devices, measuring heat, etc., can solve problems such as long positioning time and rough failure temperature positioning, and achieve rapid and efficient positioning

Pending Publication Date: 2021-10-22
58TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Usually, a larger step is used to determine, but the failure temperature location of this method is relatively rough, and each temperature needs to wait for the temperature stabilization time, so the location time will be longer

Method used

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  • Method for measuring internal temperature of integrated circuit
  • Method for measuring internal temperature of integrated circuit

Examples

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Embodiment Construction

[0016] The preferred examples of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred examples described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention. Such as figure 1 As shown, the method of measuring the internal temperature of an integrated circuit, the steps are as follows:

[0017] S1: Measure the limit operating temperature of the circuit to be tested and the voltage value of the ESD contact diode, which are T1, T2 and V1, V2 respectively, and subtract the absolute error to obtain the voltage temperature change slope S;

[0018] S2: Adjust the working temperature of the circuit until failure occurs, and record the voltage value Vf at the time of failure;

[0019] S3: Calculate the corresponding failure temperature Tf according to the failure voltage value.

[0020] In this way, the relationship curve between the d...

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Abstract

The invention relates to the technical field of integrated circuits, in particular to a method for measuring the internal temperature of an integrated circuit, which comprises the following steps: firstly, measuring the limit working temperature of a circuit to be measured and the voltage value of an ESD (Electro-Static Discharge) contact diode to obtain the voltage and temperature change slope, then adjusting the working temperature of the circuit, recording the voltage value in a failure state, and finally calculating the corresponding failure temperature. By adopting the method for measuring the internal temperature of the integrated circuit, the temperature of the circuit can be accurately obtained without additionally arranging temperature measuring equipment, the positioning is rapid, the corresponding temperature can be directly obtained by analyzing test data, constant-temperature waiting for temperature replacement every time is not needed, the temperatures of different positions of the tube core can be tested through different pins, so that the positioning of a large-area chip is quicker and more efficient.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to a method for measuring the internal temperature of integrated circuits. Background technique [0002] In the actual application process of integrated circuits, it is found that integrated circuits may fail due to temperature stress. When locating the failure, it is necessary to determine the failure temperature point. Usually, a larger step is used for determination, but the failure temperature location of this method is relatively rough, and each temperature needs to wait for a temperature stabilization time, so the location time will be relatively long. [0003] On the other hand, the vast majority of integrated circuits contain ESD protection diodes, which have characteristics that vary with temperature. When conducting forward conduction, by applying a fixed current, the conduction voltage drop can be tested, and the voltage drop varies with temperature. Therefor...

Claims

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Application Information

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IPC IPC(8): G01K7/01
CPCG01K7/01
Inventor 苏洋
Owner 58TH RES INST OF CETC
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