Method and structure for controlling the solder thickness for double sided cooling power module

A power module and welding structure technology, which is applied in the direction of circuits, electrical components, and electrical solid devices, can solve problems such as the inability to ensure the height of the solder compensation layer and the impossibility of power module manufacturing, and achieve the effect of improving cooling performance and quality

Pending Publication Date: 2021-10-22
HYUNDAI MOTOR CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the case of forming a solder layer for height adjustment (solder compensation layer) in the first process, it is necessary to manufacture the solder compensation layer to a predetermined height or higher, but there is a problem that due to the The load on the parts to be soldered in the process causes the solder to flow out horizontally, making it impossible to ensure the required height of the solder compensation layer
[0006] Furthermore, this causes the problem that it is not possible to manufacture the power module to the desired height in the subsequent second soldering process

Method used

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  • Method and structure for controlling the solder thickness for double sided cooling power module
  • Method and structure for controlling the solder thickness for double sided cooling power module
  • Method and structure for controlling the solder thickness for double sided cooling power module

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Embodiment Construction

[0035] Reference will now be made in detail to various embodiments of the invention, examples of which are illustrated in the accompanying drawings and described below. While the invention will be described in conjunction with exemplary embodiments of the invention, it will be understood that present description is not intended to limit the invention to those exemplary embodiments. On the other hand, the present invention is intended to cover not only the exemplary embodiments of the present invention but also various alternatives, modifications, Equivalents and other embodiments.

[0036] Hereinafter, a welding structure, a power module having the same, and a method for manufacturing the power module according to various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0037] figure 1 is a sectional view showing a welded structure according to various exemplary embodiments of the present invention, f...

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Abstract

Disclosed are a method and structure for controlling the solder thickness for a double sided cooling power module. In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.

Description

technical field [0001] The present invention relates to a method and structure for controlling the solder thickness of a double-sided cooling power module, which can continuously determine the height of the power module when the power module is manufactured. Background technique [0002] In general, a power supply module for converting electric power to drive a motor for EV vehicles has a structure in which electrical connections are made by combining a power semiconductor chip, substrates arranged on upper and lower parts of the power semiconductor chip, and other various components with each other. . Since power semiconductor devices have high-speed conversion that converts high power, a lot of heat is generated, in order to prevent performance degradation by easily dissipating heat, a double-sided cooling power module that can attach cooling channels to the upper and lower parts of the power module has been developed . The double-sided cooling power module has a structu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/49H01L21/60
CPCH01L24/13H01L24/45H01L24/81H01L23/3735H01L21/4882H01L24/32H01L2224/32245H01L2224/26165H01L2224/32238H01L2224/33181H01L2224/83986H01L2224/83192H01L2224/83815H01L2224/8314H01L2224/83201H01L2224/83136H01L2224/75756H01L24/83H01L24/75H01L2924/19107H01L2224/291H01L2224/814H01L2224/131H01L2924/00014H01L2924/014H01L23/367H01L23/488H01L24/29H01L24/11H01L2224/29018H01L23/3675
Inventor 金泰华俞明日
Owner HYUNDAI MOTOR CO LTD
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