HJT conductive silver glue composition and its preparation method and HJT solar cell
A technology of conductive silver glue and composition, applied in the direction of conductive adhesives, circuits, adhesives, etc., can solve the problems of poor matching of process parameters, high production costs, high volume resistivity, etc., and achieve excellent and reliable peeling mode, solidification Effect of wide process window and low volume resistivity
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Embodiment 1
[0113] A kind of HJT photovoltaic cell main grid high welding tension conductive silver adhesive, comprising the following components: the content of spherical silver powder is 45.0wt%, the content of flake silver powder is 44.8wt%, glycidyl ether epoxy resin (epoxy equivalent ( g / eq.) is 200), the content is 3.0wt%, the flexible block copolymer is a rubber-toughened epoxy resin, the relative molecular weight is Mr 1000, the content is 4.0wt%, the curing agent is an amine complex, and the content is 0.5wt%, the active diluent is 2-ethylhexyl glycidyl ether, the content is 1.0wt%, the inactive diluent is isophorone, the content is 1.5wt%, the auxiliary agent is dispersant 0.1%, adhesion promoter 0.1 wt%.
[0114] The particle size distribution of spherical silver powder is D100≤2000nm, D50≤800nm, tap density 3~8g / ml, specific surface area 0.8~2.0m 2 / g.
[0115] The particle size distribution of flake silver powder is D100≤20μm, D50≤8μm, the tap density is 3~6g / ml, and the sp...
Embodiment 2
[0118] A kind of HJT photovoltaic cell main grid high welding tension conductive silver adhesive, comprising the following components: the content of spherical silver powder is 45.0wt%, the content of flake silver powder is 44.8wt%, glycidyl ether epoxy resin (epoxy equivalent ( g / eq.) 300) content is 3.0wt%, the flexible blend polymer is a mixture of compounds containing isocyanate groups and polyester polyols, the relative molecular weight is Mr 2000, the content is 4wt%, the curing agent is amine complex The active diluent is 2-ethylhexyl glycidyl ether, the content is 1.0wt%, the inactive diluent is diethylene glycol butyl ether acetate, the content is 1.5wt%, and the auxiliary agent is 0.1% dispersant , Acrylic acid leveling agent 0.1wt%.
[0119] The particle size distribution of spherical silver powder is D100≤2000nm, D50≤800nm, tap density 3~8g / ml, specific surface area 0.8~2.0m 2 / g.
[0120] The particle size distribution of flake silver powder is D100≤20μm, D50≤8μ...
Embodiment 3
[0136] The flexible compound is a polyurethane-modified epoxy resin with an average functionality of 4 and a relative molecular weight Mr of 8000. The epoxy resin has an average functionality of 5 and an epoxy equivalent of 500; the epoxy resin is selected from glycidyl ether epoxy resins. The curing agent is a blocked isocyanate curing agent TDI. The diluent is allyl glycidyl ether, the solubility parameter is 12, the boiling point is 200° C., and the volatilization rate is less than 2.5; the auxiliary agent is a dispersant and a leveling agent.
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