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Chip sorting control system and control method

A control system and chip technology, applied in the chip sorting control system and control field, can solve the problems of low sorting efficiency and error-prone, and achieve the effect of improving sorting efficiency and reducing error rate

Active Publication Date: 2021-11-02
WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of this application provides a chip sorting control system and control method to solve the problems of error-prone and low sorting efficiency in the existing manual sorting chips

Method used

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  • Chip sorting control system and control method
  • Chip sorting control system and control method

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Embodiment Construction

[0037] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0038] The embodiments of the present application provide a chip sorting control system and a control method to solve the problems of error-prone and low sorting efficiency in existing manual chip sorting.

[0039] The semiconductor laser is formed by coupling and shaping the laser light generated by multiple COS chips into the optical fiber. Due to the inconsistent optical and electrical characteristics of each COS chip, the wavelength and frequency characteristics of the laser ...

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Abstract

The invention provides a chip sorting control system and control method, the chip sorting control system comprises a material holding assembly, a chip sucking assembly, a code scanning assembly, an input module and a control module, and the control module is connected with the material holding assembly, the chip sucking assembly, the code scanning assembly and the input module; wherein the material holding assembly is used for holding a plurality of first material boxes and second material boxes; the chip sucking assembly is used for grabbing chips; the code scanning assembly is used for obtaining label information and sending the label information to the control module; the input module is used for inputting product information and sending the product information to the control module; and the control module is used for obtaining data information of each chip in each first material box from an MES database according to the label information, calculating a grabbing path of the to-be-assembled chips according to the product information and the data information and controlling the material holding assembly and the chip sucking assembly to move according to the grabbing path, and the chip sucking assembly grabs the to-be-assembled chips and places the to-be-assembled chips in the second material boxes. The sorting efficiency is improved, and the error rate is reduced.

Description

technical field [0001] The present application belongs to the technical field of chip sorting, and in particular relates to a chip sorting control system and a control method. Background technique [0002] Semiconductor lasers are formed by coupling and shaping the laser light generated by multiple chips into the optical fiber. Due to the inconsistency of the photoelectric characteristics of each chip, the wavelength and frequency characteristics of the emitted laser light are different. In order to improve the consistency and stability of the final composite light of the product , It is necessary to select different chips with similar laser characteristics and suitable power to form the same device. At present, the chips are sorted and sorted manually, and the MES is observed by human eyes to sort out the required chips in the material and put them in a new material box. Specifically, more than 24 boxes of chips need to be sorted out manually, each box contains 56 chips, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/34B07C5/02B07C5/36B07C5/38
CPCB07C5/3412B07C5/02B07C5/362B07C5/38
Inventor 徐敏敏于享刘鑫汪韧郭庆锐闫大鹏
Owner WUHAN RAYCUS FIBER LASER TECHNOLOGY CO LTD
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