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Chamfering method of LTCC chip-type ceramic filter

A ceramic filter, chip technology, applied in surface polishing machine tools, machine tools suitable for grinding workpiece edges, grinding machines, etc. , easy to be ground or worn out, etc., to achieve the effect of shortening the circulation time, easy acquisition and low price

Pending Publication Date: 2021-11-02
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And the unsintered ceramic component green body, the Mark logo on its upper surface is extremely easy to be ground shallow or wear off in the chamfering preparation process of the chip ceramic capacitor described in CN105140027A or CN102315018A in general dry chamfering process, causes can't pass through Appearance sorting machine or testing machine, which affects the circulation and use of the chamfering process

Method used

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  • Chamfering method of LTCC chip-type ceramic filter
  • Chamfering method of LTCC chip-type ceramic filter
  • Chamfering method of LTCC chip-type ceramic filter

Examples

Experimental program
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Effect test

Embodiment 1

[0022] An embodiment of the chamfering method of the LTCC chip ceramic filter described in the present invention, the chamfering method described in the present embodiment comprises the following steps:

[0023] (1) Chamfer the LTCC chip ceramic filter with a size specification (metric system) of 3216, select alumina balls with a particle size of 3 mm and starch for ball milling, and the mass ratio of LTCC chip ceramic filter, starch, and balls The ratio is 1:0.5:3, the total volume of a single tank is 50% of the total volume of the tank, and ball milled at a speed of 150rpm for 30min;

[0024] (2) sieve the material obtained in step (1) to remove milling balls and most of the starch;

[0025] (3) Debinding and sintering the screened materials at a sintering temperature of 850° C. to obtain a processed LTCC chip ceramic filter.

[0026] figure 1 It is the appearance diagram of the LTCC chip ceramic filter without chamfering, figure 2 It is the appearance diagram of the LTC...

Embodiment 2

[0028] An embodiment of the chamfering method of the LTCC chip ceramic filter described in the present invention, the chamfering method described in the present embodiment comprises the following steps:

[0029] (1) Chamfer the LTCC chip ceramic filter with a size specification (metric system) of 2012, select zirconia balls with a particle size of 3mm and starch for ball milling, and the mass ratio of LTCC chip ceramic filter, starch and ball The ratio is 1:1:2, the total volume of a single tank is 50% of the total volume of the tank, and ball milled at a speed of 150rpm for 30min;

[0030] (2) sieve the material obtained in step (1) to remove milling balls and most of the starch;

[0031] (3) Debinding and sintering the screened materials at a sintering temperature of 850° C. to obtain a processed LTCC chip ceramic filter.

[0032] After chamfering by the method described in this embodiment, the Mark logo on the surface of the LTCC chip ceramic filter has no obvious change, ...

Embodiment 3

[0034] A kind of embodiment of the chamfering method of LTCC chip ceramic filter described in the present invention, the method described in this embodiment comprises the following steps:

[0035] (1) Chamfer the product with 1608 size specification (metric system), select zirconia balls with a particle size of 2mm and starch for ball milling, and the mass ratio of LTCC chip ceramic filter, starch and balls is 1:0.8: 2. The total volume of a single tank is 50% of the total volume of the tank, and ball milled at a speed of 165 rpm for 45 minutes;

[0036] (2) sieve the material obtained in step (1) to remove milling balls and most of the starch;

[0037] (3) Debinding and sintering the screened materials at a sintering temperature of 850° C. to obtain a processed LTCC chip ceramic filter.

[0038] After chamfering by the method described in this embodiment, the Mark logo on the surface of the LTCC chip ceramic filter has no obvious change, which is similar to that of Embodimen...

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Abstract

The invention discloses a chamfering method of an LTCC chip-type ceramic filter, and relates to the technical field of chip-type laminated ceramic elements. The chamfering method of the LTCC chip-type ceramic filter comprises the following steps: (1) putting the LTCC chip-type ceramic filter, a grinding material and a buffer substance into a ball milling tank for ball milling; (2) screening after ball milling is finished; and (3) carrying out glue discharging and sintering on the separated LTCC chip ceramic filter, wherein the grinding material is an aluminum oxide grinding ball or a zirconium oxide grinding ball, and the buffer substance comprises at least one of corn starch, glutinous rice starch, tapioca flour and glutinous rice flour. According to the chamfering method of the LTCC chip-type ceramic filter, a fillet can be chamfered, and it can be guaranteed that a Mark on the surface of the LTCC chip-type ceramic filter can be prevented from being shallowly ground or ground off.

Description

technical field [0001] The invention relates to the technical field of chip laminated ceramic components, in particular to a chamfering method of an LTCC chip ceramic filter. Background technique [0002] With the development of 5G communication technology and the increase in the penetration rate of 5G handheld terminal equipment, the gap between the supply and demand of chip ceramic filters manufactured based on LTCC technology in the 5G RF front-end continues to expand, and at the same time, higher requirements are placed on product reliability. For chip ceramic components manufactured by LTCC technology, such as chip ceramic filters, the manufacturing process includes a chamfering process. Chamfering is achieved through the collision between components and grinding media, components and components. The purpose of chamfering is to remove the burr on the surface of the component, grind off the excess scrap to fully expose the internal electrode, facilitate the sealing of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B31/02B24B31/12B24B31/16B24B31/14
CPCB24B1/00B24B31/02B24B31/12B24B31/16B24B31/14
Inventor 程飞鹏黄昆何以田陈聪
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG