Chip-type ceramic electronic component and method for manufacturing same
A technology of electronic components and manufacturing methods, which is applied in the direction of capacitor manufacturing, fixed capacitance parts, electrical components, etc., can solve problems such as short circuit, chip-type ceramic electronic component function damage, etc., and achieve the effect of reducing ESR
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no. 1 Embodiment approach
[0032] First, refer to figure 1 A multilayer ceramic capacitor 1 as a chip-type ceramic electronic component according to the first embodiment of the present invention will be described.
[0033] The laminated ceramic capacitor 1 includes a ceramic body 3 in which a plurality of ceramic layers 2 made of dielectric ceramics are laminated. The ceramic body 3 has a first main surface 5 and a second main surface 6 facing each other, a first end surface 7 connecting them, and a second end surface opposite to the first end surface 7 although not shown in the figure. Furthermore, although not shown, there is also a relative figure 1 A first side surface and a second side surface that extend parallel to the plane of paper and face each other.
[0034] Inside the ceramic body 3, a plurality of first internal electrodes 9 and second internal electrodes 10 are alternately arranged as internal conductors along the stacking direction of the ceramic layers 2, and specific ceramic layers 2...
no. 2 Embodiment approach
[0056] exist figure 2 In , a part of the multilayer ceramic capacitor 1a that is a chip-type ceramic electronic component according to the second embodiment of the present invention is schematically shown in cross-sectional view. exist figure 2 in, for with figure 1 Components corresponding to the shown components are denoted by the same reference numerals, and redundant descriptions are omitted.
[0057] Hereinafter, points of the second embodiment that are different from the first embodiment will be described.
[0058] In the multilayer ceramic capacitor 1a, when the above-mentioned glass-free frit layer 12 is used as the first glass-free frit layer 12, the external electrode 11a is also formed on the first glass-free frit layer 12. The second glass-free frit layer 18 that does not contain glass.
[0059] In order to form the external electrodes 11a as described above, as the conductive paste, in addition to the first glass-free conductive paste used for the first glas...
no. 3 Embodiment approach
[0068] exist image 3 In , a part of the multilayer ceramic capacitor 1b which is the chip-type ceramic electronic component according to the third embodiment of the present invention is schematically shown in cross-sectional view. exist image 3 in, for with figure 1 Components corresponding to the shown components are denoted by the same reference numerals, and redundant descriptions are omitted.
[0069] Hereinafter, points of the third embodiment that are different from the first embodiment will be described.
[0070] In the multilayer ceramic capacitor 1 b, the external electrode 11 b further includes a resin-containing conductor layer 19 formed on the glass-free sintered layer 12 .
[0071] In order to form the external electrodes 11 b as described above, a third glass-free conductive paste containing conductive metal powder and a thermosetting resin but not glass is prepared as a conductive paste. Here, as the conductive metal powder contained in the third glass-fre...
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Abstract
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