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On-chip thermal management for VLSI applications

A chip and processor technology, applied in the field of thermal management, can solve problems that hinder the application of integrated circuits

Pending Publication Date: 2021-11-09
INNOGRIT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This poses significant challenges to modern submicron CMOS technologies and hinders the use of integrated circuits for low-temperature applications

Method used

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  • On-chip thermal management for VLSI applications
  • On-chip thermal management for VLSI applications
  • On-chip thermal management for VLSI applications

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Embodiment Construction

[0015] Specific embodiments according to the present application will now be described in detail with reference to the accompanying drawings. For consistency, the same elements in the various figures are denoted by the same reference numerals.

[0016] figure 1 A system on chip (SoC) 100 in one embodiment according to the present disclosure is schematically shown. SoC 100 may be an integrated circuit (IC) semiconductor chip, which may include processor 102 and thermal management module 104 . Thermal management module 104 may include thermal control logic 106 , temperature sensor 108 and heater 110 . Thermal control logic block 106 may include control logic circuitry and is referred to as thermal control logic 106 . In at least one embodiment, thermal control logic 106 may be implemented with dedicated analog circuitry to ensure reliability and timing closure at extremely low temperatures. Thermal control logic 106 may be coupled to temperature sensor 108 and configured to ...

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Abstract

An apparatus and method for managing operation of a semiconductor chip are provided. In an exemplary embodiment, the semiconductor chip is provided, which may include a temperature sensor, a heater, a processor, and thermal control logic. The thermal control logic can be configured to: determine that the first readout temperature from the temperature sensor reaches the first temperature threshold, turn on the heater and determine that the second readout temperature from the temperature sensor reaches a second temperature threshold lower than the first temperature threshold, pause processor functions, determine that the third readout temperature from the temperature sensor reaches the first temperature threshold, restore processor functions; determine that the fourth readout temperature from the temperature sensor reaches a third temperature threshold higher than the first temperature threshold, and turn off the heater..

Description

technical field [0001] The present invention relates to thermal management for semiconductor dies, and more particularly thermal management for very large scale integration (VLSI) integrated circuits (ICs) and system-on-chip (SoC) applications. Background technique [0002] In modern CMOS semiconductor technology, the performance and reliability of integrated circuits have shown a great dependence on temperature. On the one hand, carrier mobility decreases with increasing temperature, which slows down circuits. On the other hand, the threshold voltage also decreases with increasing temperature, which helps to speed up the circuit. When the effect of the reduction in threshold voltage outweighs the reduction in carrier mobility, the circuit operates faster at higher temperatures. This is known as temperature inversion (Temperature Inversion) phenomenon, in the latest sub-micron CMOS technology is becoming more and more common. [0003] Integrated circuits become slower at ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/206H01L23/345H01L23/34
Inventor 不公告发明人
Owner INNOGRIT TECH CO LTD
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