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Semiconductor device having bent gate eletrode and process for production thereof

A semiconductor and gate electrode technology, applied in the field of semiconductor devices, can solve problems such as damage to transistor balance characteristics

Inactive Publication Date: 2004-01-28
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Impaired balance characteristics of transistors

Method used

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  • Semiconductor device having bent gate eletrode and process for production thereof
  • Semiconductor device having bent gate eletrode and process for production thereof
  • Semiconductor device having bent gate eletrode and process for production thereof

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Embodiment

[0038] The present invention is described in more detail below with examples. by combining along Figure 4 Each cross-sectional view taken along the line A-A' of 2000 introduces its manufacturing process, and introduces a semiconductor device having a gate electrode with a bending angle θ of 90°, such as Figure 4 (plan view).

[0039] Such as Figure 5 As shown in [(a): plan view, (b): cross-sectional view], a predetermined region of a silicon substrate 1 is covered with a mask 2 made of, for example, a silicon nitride film. Then, if Figure 6 As shown in (sectional view), the surface of the silicon substrate is partially oxidized to form a LOCOS oxide film, that is, the element isolation region 6 . The mask is used for the definition of the active region, and in this embodiment, the long side of the rectangular mask is allowed to become approximately parallel to the bisector of the bending angle θ of the gate electrode having a curved portion to be formed later.

[0040...

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Abstract

A semiconductor device comprising, on a semiconductor substrate, an element-isolating region, an active region, and a gate electrode with a bent portion having a bent-angle theta on the active region. The boundary between the element-isolating region and the active region intersects the gate electrode so that the line segments of the boundary at which said intersection takes place, are approximately parallel to the bisector of the bent-angle theta of the bent portion of the gate electrode. In this semiconductor device, the variation in width of gate electrode is small and accordingly the variation in properties is small, even when the relative position of gate electrode and active region of MOSFET has shifted slightly.

Description

technical field [0001] The invention relates to a semiconductor device with a curved gate, in particular to a semiconductor device with a MOSFET with a curved gate. Background technique [0002] MOSFETs with curved gates have been used to meet production, characterization and layout requirements. Such as Figure 12 As shown, in order to form the impurity implantation regions 39a and 39b in the active region, when using the gate 33 as a mask to perform ion implantation slightly obliquely, a non-implantation region is left between the gate 33 and the impurity implantation region 39a, As a result, an asymmetry occurs between regions 39a and 39b. Therefore, JP-A-2-250332 discloses that when the gate electrode 33 is formed on the active region 34 in a shape bent at 90°, as Figure 13 As shown, even when the ion implantation is performed slightly obliquely, no shadow occurs near the gate electrode 33, and the symmetry is improved. [0003] The large gate width results in a decr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L21/8234H01L27/088H01L29/423
CPCH01L29/4238H01L29/78
Inventor 高桥寿史熊本景太
Owner RENESAS ELECTRONICS CORP