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Electronic material with low curing temperature and production device thereof

A technology of electronic materials and curing temperature, applied in grain processing and other fields, can solve problems such as poor use effect, achieve good electrical conductivity and broad application prospects

Pending Publication Date: 2021-11-19
中科检测技术服务(重庆)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an electronic material with low curing temperature and its production device, aiming to solve the problem that some electronic materials need to be cured at high temperature, and the use effect is not good

Method used

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  • Electronic material with low curing temperature and production device thereof
  • Electronic material with low curing temperature and production device thereof
  • Electronic material with low curing temperature and production device thereof

Examples

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Embodiment Construction

[0022] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0023] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...

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PUM

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Abstract

The invention relates to the technical field of electronic materials, in particular to an electronic material with low curing temperature and a production device thereof. The electronic material with the low curing temperature can be cured at a relatively low temperature, has good conductivity, oxidation resistance, flame retardance and aging resistance, is used in heat-sensitive materials and non-weldable materials, has a wide application prospect in the increasingly high-density and miniaturized electronic assembly industry, and has a wide application prospect. The problems that some electronic materials need to be cured at high temperature, and the using effect is poor are solved.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an electronic material with low curing temperature and a production device thereof. Background technique [0002] Electronic materials refer to materials used in electronic technology and microelectronic technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and other related materials. Material. Electronic materials are the material basis for the development of modern electronics industry and science and technology, and are also technology-intensive subjects in the field of science and technology. [0003] According to the chemical properties of the material, it can be divided into metal electronic materials, electronic ceramics, polymer electronics, glass dielectrics, mica, gas ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/28C08L91/06C08K3/08C08K3/22C08K3/30C08K5/3492C08K3/38C08K3/34C08K7/08C08K3/04B02C18/10B02C18/16
CPCC08L23/286C08K3/08C08K3/22C08K3/30C08K5/34922C08K3/38C08K3/34C08K7/08C08K3/04B02C18/10B02C18/16C08K2201/001C08K2003/0862C08K2003/2231C08K2003/2296C08K2003/2272C08K2003/3045C08K2003/387C08L2201/02C08L2201/08C08L2203/20C08L91/06
Inventor 彭善峰刘沛钦叶林聂超陈婷唐毅
Owner 中科检测技术服务(重庆)有限公司