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Plastic surface metallization reactive sputtering plasma control system and method

A plasma and surface metal technology, applied in sputtering plating, ion implantation plating, metal material coating process, etc., can solve problems such as large substrate area, achieve accurate spectral information, achieve sputtering deposition rate, The effect of improving uniformity

Pending Publication Date: 2021-11-19
GUANGDONG IND TECHN COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a plasma control system and method for reactive sputtering of plastic surface metallization to solve the control problem existing due to the large area of ​​the substrate

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  • Plastic surface metallization reactive sputtering plasma control system and method
  • Plastic surface metallization reactive sputtering plasma control system and method

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Embodiment Construction

[0031] A plastic surface metallization reactive sputtering plasma control system described in the present invention is as follows: figure 1 As shown, a vacuum coating chamber 1 is included, and a substrate 2 is arranged in the vacuum coating chamber 1, and a target 7 is arranged on the opposite side of the substrate 2. A gas inlet 3 is provided between the substrate 2 and the target 7 , and an optical fiber probe 4 and a gas sensor 5 are arranged on the side of the gas inlet 3 close to the target 7 .

[0032] A reactive gas flow piezoelectric valve 10 , a working gas flow piezoelectric valve 11 , a power source 8 and a controller 9 are arranged outside the vacuum coating chamber 1 .

[0033] The voltage output terminal of the power supply 8 extends into the vacuum coating chamber 1 and connects with the target 7 .

[0034] The output ends of the reactive gas flow piezoelectric valve 10 and the working gas flow piezoelectric valve 11 are collinear and extend into the vacuum co...

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Abstract

The invention discloses a plastic surface metallization reactive sputtering plasma control system and method, and relates to a plastic surface metallization vacuum reactive sputtering coating technology. By aiming at the problem of single closed-loop feedback in the prior art, the scheme is provided, in the step of forming a film on the surface of a substrate through reactive sputtering of a target material, target current and voltage information, plasma spectrum information and gas partial pressure information are obtained in real time and input into a controller, the controller adjusts the flow of mixed gas and / or adjusts the target current and voltage, and therefore the sputtering deposition rate is stable, and sputtering film components are stable. The system and method have the advantages that spectrum feedback is taken as the main, gas feedback and current and voltage feedback are considered, quicker, more accurate and more stable control is achieved, and coating uniformity can be improved.

Description

technical field [0001] The invention relates to a plastic surface metallization vacuum reactive sputtering coating technology, in particular to a plastic surface metallization reactive sputtering plasma control system and method. Background technique [0002] As we all know, vacuum coating technology has been widely used in many industries, and it is called the core key technology in flat panel display, solar photovoltaic, new electronic information, energy-saving glass and other industries. The challenge of the future market for the vacuum coating process technology lies in the mass production of high-quality precision optical films and electrical films. At present, with the advancement of magnetron sputtering technology and equipment and technological breakthroughs in sputtering process monitoring technology, it is gradually being applied to the preparation of high-quality optical films. [0003] The reactive sputtering method is a technology used to generate compound fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/54C23C14/35C23C14/34
CPCC23C14/542C23C14/544C23C14/548C23C14/0042C23C14/3464C23C14/352
Inventor 毕君高原田先亮郭大伊黄安琪
Owner GUANGDONG IND TECHN COLLEGE